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参数资料
| 型号： | 550014 |
| 厂商： | Multicore |
| 文件页数： | 1/2页 |
| 文件大小： | 0K |
| 描述： | 63/37 WS200 SOLDER PASTE 75GM |
| MSDS 材料安全数据表： | M00515 MSDS |
| 标准包装： | 18 |
| 系列： | WS200™ |
| 制程： | 有引线 |
| 类型： | 焊膏 |
| 焊剂类型： | 水溶性 |
| 复合体： | Sn63Pb37（63/37） |
| 形态： | 注射器，75g（2.6 oz） |
| 融点： | 361°F（183°C） |
| 装运信息： | 要确保客户满意和产品完好，建议采用空运发货方式。 |
| 其它名称： | M00515 |
Technical Data Sheet
WS200?
June - 2009
PRODUCT DESCRIPTION
WS200? provides the following product characteristics:
Application Soldering
Cure Reflow
Technology Water Washable Solder Paste
WS200? is a water washable solder paste for printing and
reflow in air or nitrogen atmospheres where process yield is
critical. WS200? solder paste offers excellent open time and
good soldering activity over a wide range of reflow profiles and
surface finishes. WS200? is available with Sn62 and Sn63
alloys.
FEATURES AND BENEFITS
● Effective over a wide range of printer cycle times and print
speeds
● Excellent printer open time and between print abandon
time
● Long component tack time
● Excellent slump resistance
DIRECTIONS FOR USE
Reflow:
WS200? has been formulated for reflow in air over a wide
range of temperature profiles. The diagrams below show
example reflow profile that have been used successfully. Other
profiles may also give good results, depending on board design
factors.
Linear Profiles:
250
200
150
100
50
● Effective over a wide range of reflow profiles in air or
nitrogen
● Residues removed with deionised water rinse
0
0
60
120
180 240
Time, seconds
300
360
420
TYPICAL PROPERTIES
Solder Paste Typical Properties
Soak Profiles:
250
Alloys
Alloy melting range (°C)
Multicore Powder Size Coding
ANSI/J-STD-005
Powder Particle Size, μm
Sn62, Sn63
179, 183
AGS
Type 3
20-45μ
200
150
Metal Loading (Weight %) 88.5
Brookfield Viscosity TF spindle, 25°C, 5rpm after 780,000
2 minutes, mPa?s
Malcom Viscosity, P at 6 s -1 @ 25°C 1,550
100
50
Thixotropic Index (Ti), 25°C
(Ti = log(viscosity @ 1.8s -1 / viscosity @ 18s -1 )
Slump, J-STD-005, mm
RT, 15 minutes
0.33 x 2.03 mm pads
0.63 x 2.03 mm pads
150°C, 15 minutes
0.33 x 2.03 mm pads
0.63 x 2.03 mm pads
Initial tack force, gF
Useful open time, hours
0.68
IPC A21 Pattern
0.15
0.33
0.15
0.33
38.5
>24
0
0 60 120 180 240 300 360
Time, seconds
High air flow rates give as even a temperature distribution as
possible. However, across the board, this may contribute to
exhaustion of paste activity. WS200? combines excellent
printing characteristics with tolerance of hot profiles and high
air flow rates, although extreme (long & hot) profiles may still
give sub-optimal reflow and cleaning in some oven types.
Solder Powder:
Careful control of the atomisation process for production of
solder powders for WS200? solder pastes ensures that the
solder powder is produced to a quality level that exceeds
IPC/J-STD-006 & EN29453 requirements for sphericity, size
distribution, impurities and oxide levels. Minimum order
requirements may apply to certain alloys and powder sizes, for
availability contact your local technical service helpdesk.
As with all solder pastes, reflow may be carried out in nitrogen
if this is installed and this is likely to lessen the effects of long
hot profiles and high gas circulation rates.
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