参数资料
| 型号： | 5591S 210 MM X 300 MM 2.5 MM |
| 厂商： | 3M |
| 文件页数： | 3/4页 |
| 文件大小： | 0K |
| 描述： | THERM PAD 5591S 210X300MM 2.5MM |
| 特色产品： | Thermal Interface Materials |
| 标准包装： | 15 |
| 系列： | 5591S |
| 使用： | 片状 |
| 形状： | 矩形 |
| 外形： | 210.00mm x 300.00mm |
| 厚度： | 0.098"（2.50mm） |
| 材质： | 硅质 |
| 胶合剂： | 胶粘 - 一侧 |
| 背衬，载体： | 聚对苯二甲二乙酯（PET） |
| 颜色： | 白 |
| 导热性： | 1.0 W/m-K |
| 其它名称： | 3M9601 WX300901260 |
3M
Thermally Conductive Interface Pads 5591 and 5591S
(3)
3M Thermally Conductive Interface Pads
5516/5516S
0.5, 1.0, 1.5, 2.0
3.1
5519/5519S
0.5 to 2.0
4.1
General Information
Product selection table for 3M Thermally Conductive Materials.
Bulk Thermal
Thickness
Conductivity
Product
(mm)
(W/m-K)
Typical Applications
3M Thermally Conductive Tapes
8805
0.127
8810
0.25
0.6
8815
0.375
8820
0.50
9889FR
1.0
0.5
Applications requiring thin bonding with good thermal transfer; CPU, flex
circuit and power transformer bonding to heat sinks and other cooling
devices. Superior tack and wetting properties.
Applications requiring gap filling and bonding with good thermal transfer;
IC packages and PCB bonding to heat sinks, metal cases and other cooling
devices.
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
3M Thermally Conductive Adhesives
TC-2707
—
0.7
TC-2810
—
1.0 - 1.4
Applications requiring high adhesive strength, good surface wetting, gap
filling and good thermal transfer. IC package and PCB thermal interfacing
with heat sinks or other cooling devices.
3M Thermally Conductive Interface Pads (acrylic)
5590H
0.5 to 1.5
3.0
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
3M Thermally Conductive Interface Pads (silicone based)
5591S
0.5 to 2.0
1.0
5592
1.0 to 2.0
1.1
5592S
0.5 to 2.0
—
5595
1.0 to 2.0
1.6
5595S
0.5 to 2.0
—
Applications requiring gap filling and superior thermal performance without
bonding. IC package and PCB thermal interfacing with heat sinks or other
cooling devices and metal cases.
相关PDF资料 |
PDF描述 |
|---|---|
| 5592 210 MM X 300 MM 2.0 MM | THERM PAD 5592 210X300MM 2.0MM |
| 5595 210 MM X 300 MM 2.0 MM | THERM PAD 5595 210X300MM 2.0MM |
| 5606S | FAN 135X38 EXHAUST TUBEAXIAL 115 |
| 5656S | FAN EXHAUST 135 X 38MM 230VAC |
| 566902B04000G | BOARD LEVEL HEAT SINK |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 5591S-210x300 | 制造商:3M Electronic Products Division 功能描述:THERM COND PADS 210MMX300M SILICONE |
| 5591S-210x300-20 | 制造商:3M Electronic Products Division 功能描述:THERMAL INTERFACE PAD 210 x 300 x 2mm |
| 5591S-210x300-25 | 制造商:3M Electronic Products Division 功能描述:THERMAL INTERFACE PAD 210x300x1.5mm |
| 5591S-210x300-40 | 制造商:3M Electronic Products Division 功能描述:THERMAL INTERFACE PAD 210 x 300 x 1mm |
| 5591S-210x300-80 | 制造商:3M Electronic Products Division 功能描述:THERMAL INTERFACE PAD 210 x 300 x .5mm |
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