参数资料
| 型号： | 5595 210 MM X 300 MM 2.0 MM |
| 厂商： | 3M |
| 文件页数： | 2/4页 |
| 文件大小： | 0K |
| 描述： | THERM PAD 5595 210X300MM 2.0MM |
| 特色产品： | Thermal Interface Materials |
| 标准包装： | 20 |
| 系列： | 5595 |
| 使用： | 片状 |
| 形状： | 矩形 |
| 外形： | 210.00mm x 300.00mm |
| 厚度： | 0.079"（2.00mm） |
| 材质： | 硅质 |
| 胶合剂： | 胶粘 - 两侧 |
| 颜色： | 灰 |
| 导热性： | 1.6 W/m-K |
| 其它名称： | 3M9607 WX300902276 |
3M
Thermally Conductive Interface Pads 5595 and 5595S
(2)
Typical Physical Properties and Performance Characteristics
Note: The following technical information and data should be considered representative or typical only and should not be
used for specification purposes.
Property
Method
Value
Product Number*
3M Thermally Conductive Interface Pads 5595 and 5595S
Thermal Conductivity (W/m-K)
1.6 W/m-K
3M Test Method
with low pressure
(<10 psi)
Operating Temperature Range****
-60° to 125°C
3M Test Method
Shelf Life
Product shelf life is 24 months from date of manufacture when
3M Test Method
stored at room temperature conditions (23-25C & 50% RH)
and in the products original packaging.
Hardness Shore 00**
Shore 00 results depend on test method and thickness of the
Modified
sample tested. Typical results are in the 50-60 Shore 00
ASTM D2240
range @ 6 mm test thickness without the PEN film.
Ask 3M for more details on pad softness.
Dielectric Breakdown
400 V/mil AC (Interface Pad 5595S tested)
3M TM
(ASTM D149)
Volume Resistivity
5 x 1012 Ohms (Interface Pad 5595S tested)
ASTM D257
Flammability Rating***
UL-94-V0 (3M tested.)
UL-94-V0 TM
Note: *Interface Pad 5595S has a 9 micrometer PEN Film added to provide for a non-tacky surface, increased puncture resistance, ease of handling and
rework. **Interface Pad 5595 tested with-out PET film on product. ***9 m PEN film is a non-FR version. ****Potential Operating Temperature
Range (°C). End use application testing will determine final temperature range based on final design and other environmental conditions. Suggested
Temperature range is based on a 3M Test Method.
Application Guidelines
Substrate surfaces should be clean and dry prior to the thermal pad application to ensure best thermal performance.
A clean surface can improve the thermal performance of an application.
1.) Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface
contamination such as dust or fingerprints. Do not use “denatured alcohol” or glass cleaners, which often contain oily
components. Allow the surface to dry for several minutes before applying the thermal pad. More aggressive solvents
(such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier contamination (grease,
machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above.
Note: Be sure to read and follow the manufacturers’ precautions and directions when using solvents.
2.) Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger pressure to
help reduce the potential for air entrapment under the thermal pad during its application. Remove the release liner
before application.
3.) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with
the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts are not flat.
Flexible substrates can be assembled to rigid or flexible parts with much less concern about air entrapment because
one of the flexible substrate can conform to the other substrates during application.
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