参数资料
型号: 582-11-272-10-005414
厂商: MILL-MAX MFG CORP
元件分类: 插座
英文描述: BGA272, IC SOCKET
封装: ROHS COMPLIANT
文件页数: 1/2页
文件大小: 254K
代理商: 582-11-272-10-005414
ProductNumber:582-11-272-10-005414
272-10-005
20X20
Description:
BGA Socket
.050 Grid; BGA Socket
Surface Mount
Accepts .015-.022" Leads
PlatingCode:
11
ShellPlating:
10 μ" Gold over 100 μ" Nickel
InnerContactPlating:
10 μ" Gold over 50 μ" Nickel
#
Of
Pins
Mill-Max
Part
Number
RoHS
Compliant
272
582-11-272-10-005414
CONTACT:
Contact Used: #05, Standard 3 Finger Contact
CurrentRating= 3 Amps
BERYLLIUMCOPPERALLOY 172 (UNS C17200) per
ASTM B 194
PropertiesofBERYLLIUMCOPPER:
Chemical composition: Cu 98.1%, Be 1.9%
Temper as stamped: TD01
Properties after heat treatment (TH01):
Hardness: 36-43 Rockwell C
Mechanical Life: 100 Cycles Min.
Density: .298 lbs/in3
Electrical Conductivity: 22% IACS*
Resistance: 10 miliohms Max
Operating Temperature: -55°C/+125°C
Melting point: 980°C/865°C (liquidus/solidus)
Stress Relaxation: 96% of stress remains after
1,000 hours @ 100 °C ; 70% of stress remains
after 1,000 hours @ 200 °C
*International Annealed Copper Standard, i.e. as a % of pure copper.
Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C. For
applications up to 300°C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info.
LOOSEPIN:
Pin Used: 8214 (Brass Alloy)
Mill-Max Mfg. Corp. Datasheet — Last Modified 6/5/2009
Page 1 of 2
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