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参数资料
| 型号： | 587-1793-KIT |
| 厂商： | Taiyo Yuden |
| 文件页数： | 31/31页 |
| 文件大小： | 0K |
| 描述： | KIT INDUCTOR HI FREQ 0201 SMD |
| 标准包装： | 1 |
| 系列： | HK |
| 套件类型： | 固定 |
| 值： | 85 件 - 1.2nH ~ 100nH，各 5 件 |
| 安装类型： | 表面贴装 |
| 包括封装： | 0201（0603 公制） |
| 产品目录页面： | 1822 (CN2011-ZH PDF) |
| 工具箱内容： | (10) 587-1497-1-ND - INDUCTOR HI FREQ 100NH 5% 0201 (10) 587-1496-1-ND - INDUCTOR HI FREQ 82NH 5% 0201 (10) 587-1495-1-ND - INDUCTOR HI FREQ 68NH 5% 0201 (10) 587-1494-1-ND - INDUCTOR HI FREQ 56NH 5% 0201 (10) 587-1493-1-ND - INDUCTOR HI FREQ 47NH 5% 0201 (10) 587-1492-1-ND - INDUCTOR HI FREQ 39NH 5% 0201 (10) 587-1491-1-ND - INDUCTOR HI FREQ 33NH 5% 0201 (10) 587-1490-1-ND - INDUCTOR HI FREQ 27NH 5% 0201 (10) 587-1489-1-ND - INDUCTOR HI FREQ 22NH 5% 0201 (10) 587-1488-1-ND - INDUCTOR HI FREQ 18NH 5% 0201 更多... |
| 其它名称： | 587-1793 587-1793-ND Q6034385 TAIYO-HK0603-V1 |
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Caution
1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm.
2. The soldering iron should not directly touch the inductor.
5. Cleaning
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux
Precautions
Technical
considerations
used and purpose of the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's
characteristics.
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation
of the inductor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
（1） Excessive cleaning
a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the
cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions
should be carefully checked;
Ultrasonic output Below 20W/?
Ultrasonic frequency Below 40kHz
Ultrasonic washing period 5 min. or less
6. Post cleaning processes
◆Application of resin coatings, moldings, etc. to the PCB and components.
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the inductor's performance.
Precautions
2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat
may lead to inductor damage or destruction.
3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors.
The use of such resins, molding materials etc. is not recommended.
7. Handling
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection
or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
1. Always wear static control bands to protect against ESD.
2. Keep the inductors away from all magnets and magnetic objects.
Precautions
3. Use non-magnetic tweezers when handling inductors.
4. Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.
5. Keep bare hands and metal products（i.e., metal desk）away from chip electrodes or conductive areas that lead to chip electrodes.
6. Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
1. Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other
boards or components.
8. Storage conditions
◆Storage
1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
Recommended conditions
Precautions
Technical
considerations
Ambient temperature Below 40℃
Humidity Below 70% RH
The ambient temperature must be kept below 30℃. Even under ideal storage conditions inductor electrode solderability decreases as
time passes, so inductors should be used within 6 months from the time of delivery.
*The packaging material should be kept where no chlorine or sulfur exists in the air.
◆Storage
1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of
terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within
6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E02R01
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