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参数资料
| 型号： | 587-1799-KIT |
| 厂商： | Taiyo Yuden |
| 文件页数： | 19/21页 |
| 文件大小： | 0K |
| 描述： | KIT CAP CER HI FREQ 0402 SMD |
| 标准包装： | 1 |
| 系列： | UVK |
| 套件类型： | RF，高 Q 值，低损耗；陶瓷 MLCC |
| 值： | 250 件 - 0.3pF ~ 5.1pF，各 10 件 |
| 安装类型： | 表面贴装 |
| 包括封装： | 0402（1005 公制） |
| 产品目录页面： | 2174 (CN2011-ZH PDF) |
| 工具箱内容： | (10) 587-1024-1-ND - CAP CER 5.1PF 50V 5% 0402 (10) 587-1023-1-ND - CAP CER 4.7PF 50V 5% 0402 (10) 587-1022-1-ND - CAP CER 4.3PF 50V 5% 0402 (10) 587-1021-1-ND - CAP CER 3.9PF 50V 5% 0402 (10) 587-1020-1-ND - CAP CER 3.6PF 50V 5% 0402 (10) 587-1019-1-ND - CAP CER 3.3PF 50V 5% 0402 (10) 587-1018-1-ND - CAP CER 3PF 50V 5% 0402 (10) 587-1017-1-ND - CAP CER 2.7PF 50V 5% 0402 (10) 587-1016-1-ND - CAP CER 2.4PF 50V 5% 0402 (10) 587-1015-1-ND - CAP CER 2.2PF 50V 5% 0402 更多... |
| 其它名称： | 587-1799 587-1799-ND Q6033767 TAIYO-HIFREQCAP-V1 |
◆Adjustment of mounting machine
1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid
this, the following points shall be considerable.
（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.
（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.
（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be
used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle
placement:
Item
Single-sided mounting
Improper method
chipping
or cracking
Proper method
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
Technical
considerations
2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical
impact on the capacitors.
To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of
the pin shall be conducted periodically.
◆Selection of Adhesives
Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in
stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect
components. Therefore, the following precautions shall be noted in the application of adhesives.
（1）Required adhesive characteristics
a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive shall have sufficient strength at high temperatures.
c. The adhesive shall have good coating and thickness consistency.
d. The adhesive shall be used during its prescribed shelf life.
e. The adhesive shall harden rapidly.
f. The adhesive shall have corrosion resistance.
g. The adhesive shall have excellent insulation characteristics.
h. The adhesive shall have no emission of toxic gasses and no effect on the human body.
（2）The recommended amount of adhesives is as follows;
［Recommended condition］
Amount adhesive
After capacitor are bonded
Figure
212/316 case sizes as examples
a a
a 0.3mm min
b 100 to 120μm
c Adhesives shall not contact land
b
c
c
4. Soldering
◆Selection of Flux
Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;
（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall
not be applied.
（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.
Precautions
Technical
considerations
（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.
◆Soldering
Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.
Sn-Zn solder paste can adversely affect MLCC reliability.
Please contact us prior to usage of Sn-Zn solder.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to
corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.
1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted
and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high
humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning
methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 587180010-3 | 制造商:Digital View 功能描述:REMOTE PLAYER 500, 1080P60 HD MEDIA PLAYER - Bulk |
| 5871800xx-3 | 功能描述:显示驱动器和控制器 RemotePlayer 500 RoHS:否 制造商:Panasonic Electronic Components 工作电源电压:2.7 V to 5.5 V 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Reel |
| 587180110-3 | 制造商:Digital View 功能描述:VIEWSTREAM 500 PLAYER, 1080P60 HD MEDIA PLAYER - Bulk |
| 5871801xx-3 | 功能描述:显示驱动器和控制器 ViewStream 500 RoHS:否 制造商:Panasonic Electronic Components 工作电源电压:2.7 V to 5.5 V 最大工作温度: 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Reel |
| 587187-000 | 制造商:TE Connectivity 功能描述:55 WIRE - Cable Rools/Shrink Tubing 制造商:TE Connectivity 功能描述:55A0811-10-9F871 |
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