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参数资料
| 型号： | 5962-0920504HXA |
| 厂商： | MICROSS COMPONENTS |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 3V PROM, 70 ns, CQFP68 |
| 封装： | HERMETIC SEALED, CERAMIC, QFP-68 |
| 文件页数： | 1/27页 |
| 文件大小： | 373K |
| 代理商： | 5962-0920504HXA |
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FLASH
AS8FLC1M32
AS8FLC1M32B
Rev. 3.9 03/10
Micross Components reserves the right to change products or specications without notice.
1
FIGURE 1: PIN ASSIGNMENT
(Top View)
Hermetic, Multi-Chip Module
(MCM)
32Mb, 1M x 32, 3.3Volt Boot Block FLASH Array
Available via Applicable Specications:
MIL-PRF-38534, Class H
DSCC SMD 5962-09205
FEATURES
32Mb device, total density, organized as 1M x 32
Bottom Boot Block (Sector) Architecture
Operation with single 3.3V Supply
Available in multiple Access time variations
Individual byte control via individual byte selects (CSx\)
Low Power CMOS
Minimum 1,000,000 Program/Erase Cycles per sector
guaranteed
Sector Architecture:
One 16K byte, two 8K byte, one 32K byte and
fteen 64Kbyte sectors
Any combination of sectors can be concurrently erased
MCM supports full array (multi-chip) Erase
Embedded Erase and Program Algorithms
Erase Suspend/Resume; Supports reading data from or
programming data to a sector not being Erased
TTL Compatible Inputs and Outputs
Military and Industrial operating temperature ranges
OPTION
MARKING
Access Speed
70ns*
-70
90ns
-90
100ns
-100
120ns
-120
*Contact factory
Package
Ceramic Quad Flat Pack
Q
Ceramic Hex Inline Pack
P
Temperature Range
Full Mil (MIL-PRF-38534, Class H) /Q
Military Temp (-55oC to +125oC)
/XT
Industrial (-40oC to +85oC)
/IT
GENERAL DESCRIPTION
The AS8FLC1M32B is a 32Mb FLASH Multi
Chip Module or ganized as 1M x 32 bits. The
module achieves high speed access, low power consumption
and high reliability by employing advanced CMOS memory
technology. The military grade product is manufactured in
compliance to the MIL-PRF-38534 specications, making the
AS8FLC1M32B ideally suited for military or space applica-
tions. The module is offered in a 68-lead 0.990 inch square
ceramic quad at pack or 66-lead 1.185inch square ceramic
Hex In-line Package (HIP). The CQFP package design is tar-
geted for those applications, which require low prole SMT
Packaging.
For more products and information
please visit our web site at
www.micross.com
I/O0
I/O1
I/02
I/O5
I/O6
I/O7
GND
I/O10
I/O11
I/O17
I/O18
I/O21
I/O22
I/O23
GND
I/O26
I/O27
I/O16
I/O19
I/O25
I/O20
I/O24
I/O28
I/O30
I/O29
I/O3
I/O9
I/O4
I/O8
10
11
12
13
14
15
16
17
18
09
08
07
06
05
04
03
02
01
68
67
66
65
64
63
62
61
60
59
78
57
76
55
54
53
52
51
50
49
48
47
46
45
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
I/012
I/O14
I/O13
25
24
23
22
21
19
20
VC
C
A1
0
A8
A7
A6
WE
1\
CS
4
\
GN
D
CS
3
\
A5
A4
A3
A2
A1
A0
A9
RE
S
E
T
\
VCC
A1
1
A1
2
A1
3
A1
4
A1
5
CS1
\
OE
\
CS
2
\
A1
7
WE
2
\
WE
3
\
WE
4
\
A1
8
A1
9
NC
A1
6
26
44
I/O15
I/O31
[Package Designator QT]
I/O2
I/O1
I/O0
I/O8
I/O9
I/O10
I/O4
I/O3
I/O5
I/O6
I/O7
I/O11
I/O12
I/O13
I/O14
I/O15
I/O16
I/O17
I/O18
I/O19
I/O20
I/O21
I/O22
I/O23
I/O24
I/O25
I/O26
I/O27
I/O28
I/O29
I/O30
I/O31
A0
A18
A11
A16
A14
A15
A9
A10
A17
A8
A7
A4
A5
A6
A1
A2
A3
A12
A13
NC
CS3\
CS2\
CS1\
CS4\
A19
VCC
GND
Reset\
OE\
WE\
NC
66 HIP
Pin Assignment
[Package Designator H]
(Top View)
P
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