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参数资料
| 型号： | 5962-9083803HX |
| 厂商： | MS KENNEDY CORP |
| 元件分类： | 运算放大器 |
| 英文描述： | DUAL OP-AMP, 1500 uV OFFSET-MAX, MBFM8 |
| 封装： | HERMETIC SEALED, TO-3, 8 PIN |
| 文件页数： | 3/6页 |
| 文件大小： | 290K |
| 代理商： | 5962-9083803HX |
APPLICATION NOTES
HEAT SINKING
To select the correct heat sink for your application, refer to the
thermal model and governing equation below.
Thermal Model:
Governing Equation:
TJ = PD X (RθJC + RθCS + RθSA) + TA
Where
TJ
= Junction Temperature
PD
= Total Power Dissipation
RθJC = Junction to Case Thermal Resistance
RθCS = Case to Heat Sink Thermal Resistance
RθSA = Heat Sink to Ambient Thermal Resistance
TC
= Case Temperature
TA
= Ambient Temperature
TS
= Sink Temperature
Example:
In our example the amplifier application requires each output to
drive a 20 volt peak sine wave across a 10 ohm load for 2 amps of
output current. For a worst case analysis we will treat the 2 amps
peak output current as a D.C. output current. The power supplies
are ±35 VDC.
1.) Find Power Dissipation
PD = [(quiescent current) X (+VCC - (-VCC))] + [(VCC - VO) X IOUT]
= (30 mA) X (70V) + (15V) X (2A)+(15V)x(2A)
= 2.1W + 60W
= 62.1W
2.) For conservative design, set TJ = +150°C
3.) For this example, worst case TA = +25°C
4.) RθJC = 1.2°C/W typically
5.) RθCS = 0.15°C/W for most thermal greases
6.) Rearrange governing equation to solve for RθSA
RθSA
=(TJ - TA) / PD - (RθJC) - (RθCS)
= (150°C - 25°C) / (62.1W) - (1.2°C/W) - (0.15°C/W)
= 0.66°C/W
The heat sink in this example must have a thermal resistance of
no more than 0.66°C/W to maintain a junction temperature of no
more than +150°C. Since this value of thermal resistance may be
difficult to find, other measures may have to be taken to decrease
the overall power dissipation. Refer to the "Heat Sinking Options"
application note offered by MSK.
POWER SUPPLY CONNECTIONS
The MSK 2541 maximum supply voltage is specified as
±40V. However, single sided or unbalanced power supply
operation is permissible as long as the total power supply volt-
age does not exceed 80V. Caution should be exercised when
routing high current printed circuit paths. Generally, these paths
should not be placed near low level, high impedance input cir-
cuitry to avoid oscillations.
During prototype evaluation, power supply current limiting
is strongly advised to avoid damaging the device. See the
application note entitled "Current Limit" for an explanation of
the limitations of the MSK 2541 on board current limit.
POWER SUPPLY BYPASSING
Both the negative and the positive power supplies must be
effectively decoupled with a high and low frequency bypass
circuit to avoid power supply induced oscillation. An effective
decoupling scheme consists of a 0.1 microfarad ceramic ca-
pacitor in parallel with a 4.7 microfarad tantalum capacitor from
each power supply pin to ground. It is also a good practice
with very high power op-amps, such as the MSK 2541, to
place a 30-50 microfarad non-electrolytic capacitor with a low
effective series resistance in parallel with the other two power
supply decoupling capacitors. This capacitor will eliminate any
peak output voltage clipping which may occur due to poor power
supply load regulation. All power supply decoupling capaci-
tors should be placed as close to the package power supply
pins as possible (pins 3 and 6).
CURRENT LIMIT
The internal current limit should not be used as a short circuit
protection scheme. When the output is directly shorted to
ground, the power supply voltage is applied across the output
transistor that is conducting. If the power supplies were set to
±40V and the output was shorted to ground, the transistor
that is conducting current would see 40V from its emitter to its
collector. Referring to the safe operating area curve shows
when [VCC-VOUT]=40V, the maximum safe output current (IO)
at TC=25°C is 1.5A. In this case the amplifier would not be
protected by the internal current limit and would probably be
damaged. The internal current limit is provided as a protection
against unintentional load conditions which may require larger
amounts of load current than the amplifier is rated for.
SAFE OPERATING AREA
The safe operating area curve is a graphical representation of
the power handling capability of the amplifier under various
conditions. The wire bond current carrying capability, transis-
tor junction temperature and secondary breakdown limitations
are all incorporated into the safe operating area curves. All
applications should be checked against the S.O.A. curves to
ensure high M.T.T.F.
3
Rev. H 2/08
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