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参数资料
| 型号： | 5962F9861301VXX |
| 厂商： | INTERSIL CORP |
| 元件分类： | 比较器 |
| 英文描述： | QUAD COMPARATOR, 2000 uV OFFSET-MAX, CDFP14 |
| 封装： | CERAMIC, FP-14 |
| 文件页数： | 2/2页 |
| 文件大小： | 41K |
| 代理商： | 5962F9861301VXX |
2
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certication.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
3750
m x 2820m (148 mils x 111 mils)
483
m ± 25.4m (19 mils ± 1 mil)
INTERFACE MATERIALS:
Glassivation:
Type: Silox (SiO2)
Thickness: 8.0k
± 1.0k
Top Metallization:
Type: AlSiCu
Thickness: 16.0k
± 2k
Substrate:
Radiation Hardened Silicon Gate, Dielectric Isolation
Backside Finish:
Silicon
ASSEMBLY RELATED INFORMATION:
Substrate Potential:
Unbiased (DI)
ADDITIONAL INFORMATION:
Worst Case Current Density:
<2.0 x 105 A/cm2
Transistor Count:
49
Metallization Mask Layout
HS-139RH
GND
+IN4
-IN4
V+
-IN1
+IN1
+IN3
-IN3
+IN2
-IN2
OUT4
OUT3
OUT2
OUT1
(9)
(8)
(7)
(6)
(5)
(4)
(3)
(2)
(1)
(14)
(13)
(12)
(11)
(10)
HS-139RH
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