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参数资料
| 型号： | 597D226X9063F8T |
| 厂商： | Vishay Sprague |
| 文件页数： | 8/20页 |
| 文件大小： | 0K |
| 描述： | CAP TANT 22UF 63V 10% 3024 |
| 标准包装： | 250 |
| 系列： | TANTAMOUNT® 597D |
| 电容： | 22µF |
| 电压 - 额定： | 63V |
| 容差： | ±10% |
| ESR（等效串联电阻）： | 250 毫欧 |
| 类型： | 保形涂层 |
| 工作温度： | -55°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 3024（7660 公制） |
| 尺寸/尺寸： | 0.299" L x 0.236" W（7.60mm x 6.00mm） |
| 高度 - 座高（最大）： | 0.201"（5.10mm） |
| 制造商尺寸代码： | F |
| 特点： | 通用 |
| 包装： | 带卷 (TR) |
Typical Performance Characteristics
www.vishay.com
CAPACITOR ENVIRONMENTAL CHARACTERISTICS
Vishay Sprague
ITEM
CONDITION
ENVIRONMENTAL CHARACTERISTICS
Humidity tests
At 40 °C/90 % RH 1000 h, no voltage applied. ?
Capacitance change ?
Cap. ? 600 μF ?
Cap. > 600 μF ?
Dissipation factor
?
Within ± 10 % of initial value ?
Within ± 20 % of initial value ?
Not to exceed 150 % of initial ?
+25 °C requirement
Temperature cycles
Moisture resistance
Thermal shock
At -55 °C/+125 °C, 30 min each, for 5 cycles.
MIL-STD-202, method 106 at rated voltage,
42 cycles.
Capacitors are subjected to 5 cycles of the
following: ?
-55 °C (+0 °C, -5 °C) for 30 min, then ?
+25 °C (+10 °C, -5 °C) for 5 min, then ?
+125 °C (+3 °C, -0 °C) for 30 min, then ?
Capacitance change ?
Cap. ? 600 μF ?
Cap. > 600 μF ?
Dissipation factor ?
Leakage current
Capacitance change ?
Cap. ? 600 μF ?
Cap. > 600 μF ?
Dissipation factor ?
Leakage current
Capacitance change ?
Cap. ? 600 μF ?
Cap. > 600 μF ?
Dissipation factor ?
Leakage current
?
Within ± 10 % of initial value ?
Within ± 20 % of initial value ?
Initial specified value or less ?
Initial specified value or less
?
Within ± 10 % of initial value ?
Within ± 20 % of initial value ?
Initial specified value or less ?
Initial specified value or less
?
Within ± 10 % of initial value ?
Within ± 20 % of initial value ?
Initial specified value or less ?
Initial specified value or less
+25 °C (+10 °C, -5 °C) for 5 min
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION
CONDITION
POST TEST PERFORMANCE
Shear test
Apply a pressure load of 5 N for 10 s ± 1 s
horizontally to the center of capacitor side body.
Capacitance change ?
Dissipation factor ?
Leakage current
Within ± 10 % of initial value ?
Initial specified value or less ?
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Substrate bend
Vibration
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 3 mm, for a total of 3 bends at a rate of 1 mm/s.
MIL-STD-202, method 204, condition D, 10 Hz to
2000 Hz, 20 g peak
Capacitance change ?
Dissipation factor ?
Leakage current
Capacitance change ?
Dissipation factor ?
Leakage current
Within ± 10 % of initial value ?
Initial specified value or less ?
Initial specified value or less
Within ± 10 % of initial value ?
Initial specified value or less ?
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Shock
MIL-STD-202, method 213B shock (specified
pulse), condition I, 100 g peak
Capacitance change ?
Dissipation factor ?
Leakage current
Within ± 10 % of initial value ?
Initial specified value or less ?
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Resistance to solder heat
? Recommended reflow profiles temperatures
and durations are located within the Capacitor
Series Guides
Capacitance change ?
Dissipation factor ?
Leakage current
Within ± 10 % of initial value ?
Initial specified value or less ?
Initial specified value or less
? Pb-free and lead-bearing series caps are
backward and forward compatible
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Solderability
MIL-STD-2002, method 208, ANSI/J-STD-002,
test B. Applies only to solder and tin plated
terminations. ?
Capacitance change ?
Dissipation factor ?
Leakage current
Within ± 10 % of initial value ?
Initial specified value or less ?
Initial specified value or less
Does not apply to gold terminations.
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Resistance to solvents
MIL-STD-202, method 215
Capacitance change ?
Dissipation factor ?
Leakage current
Within ± 10 % of initial value ?
Initial specified value or less ?
Initial specified value or less
There shall be no mechanical or visual damage to
capacitors post-conditioning.
Flammability
Encapsulent materials meet UL 94 V-0 with an
oxygen index of 32 %.
Revision: 03-Feb-14
3
Document Number: 40088
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 597D227X0016E2T | 功能描述:钽质电容器-固体SMD 220uF 16volts 20% E case Conformal RoHS:否 制造商:AVX 电容:100 uF 电压额定值:20 V ESR: 容差:10 % 外壳代码 - in:2917 外壳代码 - mm:7343 高度:4.1 mm 制造商库存号:E Case 工作温度范围:- 55 C to + 125 C 系列:TBM 产品:Tantalum Solid Low ESR Commercial Grade 封装:Bulk |
| 597D227X0020R2T | 功能描述:钽质电容器-固体SMD 220uF 20volts 20% R case Conformal RoHS:否 制造商:AVX 电容:100 uF 电压额定值:20 V ESR: 容差:10 % 外壳代码 - in:2917 外壳代码 - mm:7343 高度:4.1 mm 制造商库存号:E Case 工作温度范围:- 55 C to + 125 C 系列:TBM 产品:Tantalum Solid Low ESR Commercial Grade 封装:Bulk |
| 597D227X0025M2T | 功能描述:钽质电容器-固体SMD 220uF 25volts 20% M case Conformal RoHS:否 制造商:AVX 电容:100 uF 电压额定值:20 V ESR: 容差:10 % 外壳代码 - in:2917 外壳代码 - mm:7343 高度:4.1 mm 制造商库存号:E Case 工作温度范围:- 55 C to + 125 C 系列:TBM 产品:Tantalum Solid Low ESR Commercial Grade 封装:Bulk |
| 597D227X0025M8T | 制造商:Vishay Intertechnologies 功能描述:597D227X0025M8T |
| 597D227X9016E2T | 功能描述:钽质电容器-固体SMD 220uF 16volts 10% E case Conformal RoHS:否 制造商:AVX 电容:100 uF 电压额定值:20 V ESR: 容差:10 % 外壳代码 - in:2917 外壳代码 - mm:7343 高度:4.1 mm 制造商库存号:E Case 工作温度范围:- 55 C to + 125 C 系列:TBM 产品:Tantalum Solid Low ESR Commercial Grade 封装:Bulk |
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