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参数资料
| 型号： | 6-1437536-3 |
| 元件分类： | 插座 |
| 英文描述： | DIP32, IC SOCKET |
| 文件页数： | 1/3页 |
| 文件大小： | 208K |
| 代理商： | 6-1437536-3 |
Sockets
DIP Sockets
532-AG10D-ES
(Tyco Electronics P/N: 6-1437536-3)
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Searchable Features:
Brand:
AMP
RoHS/ELV Compliance:
RoHS compliant,
ELV compliant
Lead Free Solder
Process:
Reflow solder
capable to 245°C
Product Type:
DIP Socket
No. of Positions:
32
Row-to-Row Spacing
(mm [in]):
15.24 [0.600]
Contact Mount:
Thru Hole
Mount Style:
Vertical
Centerline (mm [in]):
2.54 [0.100]
Profile:
Standard
Frame Style:
Closed
Leg Style:
Straight
Contact Material:
Beryllium Copper
Other Properties:
RoHS/ELV Compliance
History:
Always was
compliant
Insulation Resistance
(MΩ):
5,000
Contact Resistance
(mO):
10
Sleeve Material:
Brass/Copper
Contact Termination
Area Plating:
Gold
Product Series:
500 Series
相关PDF资料 |
PDF描述 |
|---|---|
| 6-1437536-4 | DIP32, IC SOCKET |
| 6-1437536-5 | DIP32, IC SOCKET |
| 6-1437536-8 | DIP32, IC SOCKET |
| 6-1437537-4 | DIP20, IC SOCKET |
| 6-1437537-6 | DIP20, IC SOCKET |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 6-1437536-4 | 功能描述:IC 与器件插座 32 POS THRU HOLE 3000 RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 6-1437536-5 | 功能描述:IC 与器件插座 532-AG11D-ESL=SOCKET ASSEMBLY RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 6-1437536-8 | 功能描述:IC 与器件插座 532-AG12D-ES=SOCKET ASSEMBLY RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 6-1437537-0 | 功能描述:IC 与器件插座 818-AG12D=SOCKET ASY RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
| 6-1437537-4 | 功能描述:IC 与器件插座 20 POS THRU HOLE RoHS:否 制造商:Molex 产品:LGA Sockets 节距:1.02 mm 排数: 位置/触点数量:2011 触点电镀:Gold 安装风格:SMD/SMT 端接类型:Solder 插座/封装类型:LGA 2011 工作温度范围:- 40 C to + 100 C |
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