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参数资料
| 型号： | 6N134 |
| 元件分类： | 光电耦合器 |
| 英文描述： | 2 CHANNEL LOGIC OUTPUT OPTOCOUPLER, 10 Mbps |
| 封装： | HERMETIC SEALED, DIP-16 |
| 文件页数： | 5/12页 |
| 文件大小： | 448K |
| 代理商： | 6N134 |
2
Each channel contains a GaAsP light emitting diode
whichisopticallycoupledtoanintegratedhighspeed
photondetector.Theoutputofthedetectorisanopen
collector Schottky clamped transistor. Internal shields
provideaguaranteedcommonmodetransientimmuni-
tyspecificationof1000V/s.ForIsolationVoltageappli-
cationsrequiringupto2500Vdc,theHCPL-5650familyis
alsoavailable.Packagestylesforthesepartsare8and16
pinDIPthroughhole(caseoutlinesPandErespectively),
and16pinsurfacemountDIPflatpack(caseoutlineF),
leadless ceramic chip carrier (case outline 2). Devices
maybepurchasedwithavarietyofleadbendandplat-
ingoptions.SeeSelectionGuideTablefordetails.Stan-
dardMicrocircuitDrawing(SMD)partsareavailablefor
eachpackageandleadstyle.
Becausethesameelectricaldie(emittersanddetectors)
are used for each channel of each device listed in this
data sheet, absolute maximum ratings, recommended
operatingconditions,electricalspecifications,andper-
formancecharacteristicsshowninthefiguresareiden-
tical for all parts. Occasional exceptions exist due to
package variations and limitations, and are as noted.
Additionally,thesamepackageassemblyprocessesand
materialsareusedinalldevices.Thesesimilaritiesgive
justificationfortheuseofdataobtainedfromonepart
torepresentotherparts’performanceforreliabilityand
certainlimitedradiationtestresults.
Selection Guide–Package Styles and Lead Configuration Options
Package
16 Pin DIP
8 Pin DIP
16 Pin Flat Pack
20 Pad LCCC
LeadStyle
ThroughHole ThroughHole ThroughHole ThroughHole UnformedLeads SurfaceMount
Channels
2
1
2
4
2
CommonChannelWiring
V
CC,GND
None
V
CC,GND
V
CC,GND
V
CC,GND
None
WithstandTestVoltage
1500Vdc
2500Vdc
1500Vdc
Avago Part # & Options
Commercial
6N134[1]
HCPL-5600
HCPL-5630
HCPL-5650
HCPL-6650
HCPL-6630
MIL-PRF-38534,ClassH
6N134/883B
HCPL-5601
HCPL-5631
HCPL-5651
HCPL-6651
HCPL-6631
MIL-PRF-38534,ClassK
HCPL-268K
HCPL-560K
HCPL-563K
HCPL-665K
HCPL-663K
StandardLeadFinish
GoldPlate
SolderPads*
SolderDipped*
Option#200
ButtCut/GoldPlate
Option#100
GullWing/Soldered*
Option#300
Class H SMD Part #
Prescriptforallbelow
None
5962-
None
EitherGoldorSolder
8102801EX
9085501HPX
8102802PX
8102805PX
8102804FX
81028032X
GoldPlate
8102801EC
9085501HPC
8102802PC
8102805PC
8102804FC
SolderDipped*
8102801EA
9085501HPA
8102802PA
8102805PA
81028032A
ButtCut/GoldPlate
8102801UC
9085501HYC
8102802YC
ButtCut/Soldered*
8102801UA
9085501HYA
8102802YA
GullWing/Soldered*
8102801TA
9085501HXA
8102802ZA
Class K SMD Part #
Prescriptforallbelow
5962-
EitherGoldorSolder
9800101KEX
9085501KPX
9800102KPX
9800104KFX
9800103K2X
GoldPlate
9800101KEC
9085501KPC
9800102KPC
9800104KFC
SolderDipped*
9800101KEA
9085501KPA
9800102KPA
9800103K2A
ButtCut/GoldPlate
9800101KUC
9085501KYC
9800102KYC
ButtCut/Soldered*
9800101KUA
9085501KYA
9800102KYA
GullWing/Soldered*
9800101KTA
9085501KXA
9800102KZA
*Soldercontainslead.
Note:
1.JEDECregisteredpart.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 6N134#100 | 功能描述:高速光耦合器 10MBd 2CH 1500Vdc Hermetically sealed RoHS:否 制造商:Avago Technologies 电流传递比: 最大波特率: 最大正向二极管电压:1.75 V 最大反向二极管电压:5 V 最大功率耗散:40 mW 最大工作温度:+125 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-5 封装:Tube |
| 6N134#200 | 功能描述:高速光耦合器 10MBd 2CH 1500Vdc Hermetically sealed RoHS:否 制造商:Avago Technologies 电流传递比: 最大波特率: 最大正向二极管电压:1.75 V 最大反向二极管电压:5 V 最大功率耗散:40 mW 最大工作温度:+125 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-5 封装:Tube |
| 6N134#300 | 功能描述:高速光耦合器 10MBd 2CH 1500Vdc Hermetically sealed RoHS:否 制造商:Avago Technologies 电流传递比: 最大波特率: 最大正向二极管电压:1.75 V 最大反向二极管电压:5 V 最大功率耗散:40 mW 最大工作温度:+125 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-5 封装:Tube |
| 6N134/883B | 功能描述:高速光耦合器 10MBd 2CH 1500Vdc Hermetically sealed RoHS:否 制造商:Avago Technologies 电流传递比: 最大波特率: 最大正向二极管电压:1.75 V 最大反向二极管电压:5 V 最大功率耗散:40 mW 最大工作温度:+125 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-5 封装:Tube |
| 6N134/883B#100 | 功能描述:高速光耦合器 10MBd 2CH 1500Vdc Hermetically sealed RoHS:否 制造商:Avago Technologies 电流传递比: 最大波特率: 最大正向二极管电压:1.75 V 最大反向二极管电压:5 V 最大功率耗散:40 mW 最大工作温度:+125 C 最小工作温度:- 40 C 封装 / 箱体:SOIC-5 封装:Tube |
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