参数资料
| 型号： | 7137DG |
| 厂商： | Aavid Thermalloy |
| 文件页数： | 18/116页 |
| 文件大小： | 0K |
| 描述： | BOARD LEVEL HEAT SINK |
| 产品培训模块： | How to Select a Heat Sink |
| 标准包装： | 1,000 |
| 类型： | 插件板级，垂直 |
| 冷却式包装： | TO-220 |
| 固定方法： | 夹和 PC 引脚 |
| 形状： | 矩形 |
| 长度： | 0.848"（21.55mm） |
| 宽： | 0.90"（22.86mm） |
| 机座外的高度（散热片高度）： | 0.375"（9.52mm） |
| 温升时的功耗： | 1.5W @ 50°C |
| 在强制气流下的热敏电阻： | 在 200 LFM 时为10.0°C/W |
| 自然环境下的热电阻： | 20.8°C/W |
| 材质： | 铜 |
| 材料表面处理： | 锡 |
| 其它名称： | 043089 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页当前第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页第109页第110页第111页第112页第113页第114页第115页第116页
114
A
C
CESSORIES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886 (2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
Grease & Epoxy
Ther-O-Bond
TM 1500 is a versatile epoxy casting system developed
for high performance, production potting and encapsulating appli-
cations where low shrinkage and rapid air evacuation are required.
This formulation has a very low surface tension and a flowable
viscosity, which affords excellent air release. Ther-O-Bond
TM 1500
adhers to rigid plastics and laminates, metals and ceramics, has
a low coefficient of thermal expansion and is readily machined
and shaped with ordinary shop tools. The fully cured epoxy system
is an excellent electrical insulator which provides good resistance
to electrolysis, leakage and corrosion room water, weather, gases
and chemical compounds.
Ther-O-Bond
TM Adhesive
Mix ratio by weight,
100 to 15
resin to hardener:
Mixed viscosity @ 25°C, cps:
1000 - 1500
Work-life @ 25°C
45 Minutes
Gel time @ 25°C
3-6 Hours
Cure schedule @ 25°C
8 Hours
Cure schedule @ 65°C
1 Hour
Cure schedule @ 100°C
0.5 Hour
For smaller applications, Ther-O-Bond
TM 1600 produces a stable,
durable, high-impact bond, with good heat transfer characteris-
tics. It is a thixotropic (smooth paste) thermally conductive epoxy
system used for staking thermistors, diodes, resistors, integrated
circuits and other heat sensitive components to printed circuit
boards. This two-part adhesive develops strong, durable, high
impact bonds at room temperature, which improve heat transfer
while maintaining electrical insulation. Ther-O-bond
TM 1600 bonds
readily to itself, to metals, silica, steatie, alumina, sapphire and
other ceramics, glass, plastics and many other materials because
its coefficient of thermal expansion provides a good match for
those materials over a fairly wide temperature range.
Mix ratio by weight,
100 to 5
resin to hardener:
Mixed viscosity @ 25°C, cps:
33,000
Work-life @ 25°C
45 Minutes
Gel time @ 25°C
3-6 Hours
Cure schedule @ 25°C
8 Hours
Cure schedule @ 65°C
1 Hour
Cure schedule @ 100°C
0.5 Hour
HANDLING CHARACTERISTICS
Color
Blue
Specific gravity:
2.30
Operating temp, °C
-70 to 115
Hardness, shore D:
90
Izod impact, F1 Lbs/Inch of notch
0.49
Thermal
0.85
conductivity W/(m-°C)
C.T.E. (ppm/°C)
25
Tensile strength (@25°C)
9200 psi
Tensile lap shear, psi
2900
Dielectric strength (volts/mil)
410
Dielectric constant (1 KHz @ 25°C)
5.9
Dissipation factor, KH@ 25°C
5.9
Shelf life
18 months*
Ther-O-Bond
TM 2000 acrylic adhesive cures rapidly
at room temperature, while providing a repairable,
thermally conductive bond.
Color
White
Thermal
0.48
conductivity W/(m-°C)
C.T.E. (ppm/°C)
25
Tensile strength (@25°C)
2360 psi
Dielectric strength (volts/mil)
220
Shelf life
18 months*
Part number
Description
Package/Kit
Size
159900F00000G
Ther-O-BondTM 1500
Resin and hardener
0.946 liter (1 qt)
161000F00000G
Ther-O-BondTM 1600
2-Part plastic kit
10gm (0.35 oz)
164000F00000G
Ther-O-BondTM 1600
2-Part plastic kit
40gm (1.40 oz)
200000F00000G
Ther-O-BondTM 2000
Adhesive syringe
25ml
Activator bottle
13ml
ORDERING INFORMATION
PRODUCT INFORMATION
Ther-O-Bond
TM 1500
Ther-O-Bond
TM 1600
Ther-O-Bond
TM 2000
HANDLING CHARACTERISTICS
PHYSICAL PROPERTIES
Color
Black
Specific gravity
1.5
Operating temp, °C
-60 to 155
Heat distortion temp, °C
100
Hardness, shore D:
88
Thermal
1.26
conductivity W/(m°C)
Compressive strength, psi
14,000
Dissipation factor,
0.01
Self extinguishing:
yes
C.T.E. (ppm/°C)
25
Tensile strength (@25°C)
9200 psi
Dielectric
800
Shelf life
18 months*
PHYSICAL PROPERTIES
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
* Stated shelf life is from date of manufacture. To allow for inventory cycle, product shipped from Aavid will
have less than 18 months remaining shelf life. Aavid guarantees a minimum of 3 months remaining shelf life.
Please adjust order quantity so all product will be consumed within 3 months of date of shipment.
相关PDF资料 |
PDF描述 |
|---|---|
| 7139DG | BOARD LEVEL HEAT SINK |
| 7141DG | BOARD LEVEL HEATSINK .515"TO-220 |
| 7148DG | BOARD LEVEL HEAT SINK |
| 714F | FAN TUBEAXIAL 70X15MM 24VDC |
| 7212N | FAN TUBEAXIAL 150X55MM 12VDC |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 7137-SS-20 | 制造商:RAF Electronic Hardware 功能描述: |
| 7138.0501.0000 | 制造商:Molex 功能描述: |
| 7138.5093 | 制造商:SCHURTER 制造商全称:Schurter Inc. 功能描述:FUSEHOLDERS / SICHERUNGSHALTER |
| 7138.5098 | 制造商:SCHURTER 制造商全称:Schurter Inc. 功能描述:FUSEHOLDERS / SICHERUNGSHALTER |
| 7138.8431 | 制造商:SCHURTER 制造商全称:Schurter Inc. 功能描述:FUSEHOLDERS / SICHERUNGSHALTER |
发布紧急采购，3分钟左右您将得到回复。