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参数资料
| 型号： | 736440201 |
| 厂商： | MOLEX INC |
| 元件分类： | 电路板相叠连接器 |
| 英文描述： | 72 CONTACT(S), MALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER |
| 文件页数： | 1/3页 |
| 文件大小： | 228K |
| 代理商： | 736440201 |
J-36
MX01
Backplane
Connector
Systems
J
FEATURES AND SPECIFICATIONS
2.00mm (.079") Pitch
HDM*
Board-to-Board
Backplane Header
73644
Vertical
Press-Fit Guide Pin Option
Features and Benets
s
Similar features as the 73642 header
s
Eye of the needle press-t for high reliability
s
Metal hex key offers 8 coding combinations (64 with
2 keys) and makes metallic sound when card is in
wrong slot
s
Guide pin provides ± 1.9mm of capture prior to plastic
mating
s
Can use 1 guide pin in center of connector or on both ends
s
Guide pin module attached to header enhances accuracy
and reduces parts count
s
Surface Mount Compatible
Reference Information
Product Specication: PS-73670-9999
Packaging: Tube
UL File No.: E29179
Designed In: Millimeters
Electrical
Current: 1.0A
Contact Resistance:
Dielectric Withstanding Voltage: 1000V
Insulation Resistance: 1000 M
min.
Mechanical
Insertion Force: 135N max. per press-fit pin
Retention Force: 22.5N min. per press-fit pin
Mating Force: 0.35N typical per contact
Unmating Force: 0.15N min.
Signal Normal Force: 0.75N nom./0.60N min.
Durability: 250 cycles
Physical
Housing: Liquid crystal polymer
Contact: Phosphor Bronze
Plating: 30
" Gold
Operating Temperature: -55 to +105C
Row
AB
CD
E
F
m
max.
13
18
20
25
30
32
CATALOG DRAWING (FOR REFERENCE ONLY)
0.71
.028
DIA plated thru hole TYP
0.838
0.0330
DIA drilled hole
ORDERING INFORMATION AND DIMENSIONS
* High Density Metric and HDMPLUS are trademarks of Teradyne, Inc.
Note: Additional key combinations and locations are available, please contact Molex
Note: Tin/Lead press-t zones are used for bare Copper or Gold plated PCBs
Note: The guide pin must mate with the top position on the mating receptacle to clear the board edge. Therefore, if
guidepin headers are used on each end of a header array, you should select one with the pin in location B and the
second with the guidepin in location A.
Circuits
Order No.
Termination
Dimension
Location B = Pin
Location A = No Code
Location B = No Code
Location A = Pin
Location B = Pin
Location A = Code A
Location B = Code A
Location A = Pin
A
B
M
72
73644-0016
73644-0017
73644-0000
73644-0001
Standard Press-Fit
31.60 (1.244)
22.00 (.866)
5.00 (.197)
73644-0216
73644-0217
73644-0200
73644-0201
Standard Press-Fit
31.60 (1.244)
22.00 (.866)
6.00 (.236)
73644-2016
73644-2017
73644-2000
73644-2001
Tin/Lead Press-Fit
31.60 (1.244)
22.00 (.866)
5.00 (.197)
73644-2216
73644-2217
73644-2200
73644-2201
Tin/Lead Press-Fit
31.60 (1.244)
22.00 (.866)
6.00 (.236)
144
73644-1016
73644-1017
73644-1000
73644-1001
Standard Press-Fit
55.60 (2.189)
46.00 (1.811)
5.00 (.197)
73644-1216
73644-1217
73644-1200
73644-1201
Standard Press-Fit
55.60 (2.189)
46.00 (1.811)
6.00 (.236)
73644-3016
73644-3017
73644-3000
73644-3001
Tin/Lead Press-Fit
55.60 (2.189)
46.00 (1.811)
5.00 (.197)
73644-3216
73644-3217
73644-3200
73644-3201
Tin/Lead Press-Fit
55.60 (2.189)
46.00 (1.811)
6.00 (.236)
Custom
73650-XXXX
Custom
Application Note
The backplane headers are delivered as modules and are press-fitted into the backplane. This
allows maximum flexibility with minimum inventory. Note that the guidepins are an integral
part of the headers. This also means that you may have different part numbers for left-
handed and right-handed headers. You must consult the customer print to determine the
appropriate part number for various combinations of guide pin locations (2) and coding pin
orientations (8).
相关PDF资料 |
PDF描述 |
|---|---|
| 73651-0222 | 22 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER |
| 73651-0223 | 23 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER |
| 73651-0224 | 24 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER |
| 73651-0225 | 25 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER |
| 73651-0226 | 26 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 73644-0201 | 功能描述:高速/模块连接器 HDM Backplane Module Module 30 SAu 72Ckt RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold |
| 73644-0202 | 功能描述:高速/模块连接器 HDM Backplane Module Module 30 SAu 72Ckt RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold |
| 73644-0203 | 功能描述:高速/模块连接器 HDM BP GP Polz Pn AB n AB 30 SAu GF 72Ckt RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold |
| 73644-0204 | 功能描述:高速/模块连接器 HDM BP GP Polz Pn 30 z Pn 30 SAu GF 72Ckt RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold |
| 73644-0205 | 功能描述:高速/模块连接器 2MM HDM BP GP Polz P n AC 30 SAu GF 72Ckt RoHS:否 制造商:Molex 系列:iPass 产品类型: 排数: 列数: 位置/触点数量:38 安装角:Right 节距:0.8 mm 安装风格:Plug 端接类型:SMD/SMT 外壳材料:Thermoplastic 触点材料:High Performance Alloy (HPA) 触点电镀:Gold |
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