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| 型号： | 73S1217F-EB |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 3/93页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL 73S1217F CBL/DOC/CD |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 1 |
| 系列： | * |
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UG_12xxF_016
73S12xxF Software User Guide
Rev. 1.50
11
2.2.3
External Application
An external application can run on a PC or any host microprocessor. The 73S12xxF supports two
options to interface with a PC external application: RS-232/Serial interface or USB V2.0 full speed
interface.
RS232 / Serial Interface
When using the RS-232 or a generic asynchronous serial interface, TSC can provide the sample source
code for a serial / RS-232 firmware application. It implements a SLIP protocol which enables the transfer
of data between the PC (or a host microprocessor) and the 73S12xxF. The serial communication speed
can range from 9600 bps to 115200 bps, with consideration of the selected CPU clock speed. Contact a
Teridian Semiconductor sales representative for availability. For more information, refer to the Pseudo-
CCID Host GUI Users Guide, the Pseudo-CCID Host Application Guide, and the Pseudo-CCID
Serial/RS232 Firmware Application Note.
USB V2.0 Full Speed Interface
When using the USB V2.0 full speed interface, the communication speed is fixed at 12 Mbps. Software
included with the TSC 73S12xxF Evaluation Boards provides sample source code for a USB firmware
application to be run with either a Microsoft generic CCID USB driver (for XP) or the TSC customized
driver (also included in the release). When the CCID-USB firmware is loaded and either the Microsoft or
TSC driver is used on the host side, any PC/SC compliant application for Windows XP would be able to
communicate and control the Reader. For more information, refer to the USB-CCID Host GUI Users
Guide and the CCID Application Note.
2.2.4
Embedded Application
A user written embedded application can link directly to the TSC low-level API to better handle hardware
control, timing or interrupts. In addition, an embedded application can be significantly simplified by using
the TSC High-level API to gain access to the Smart Card protocol interfaces, especially when software
certification is desired to meet USB 2.0, EMV 2000, ISO 7816 or Microsoft Windows Logo.
2.2.5
Build Environment with the Serial Boot Loader
Starting with the Teridian P-CCID Release version 2.00 or higher, the Boot Loader API is included in the
Low-Level library (LAPI-?BL.lib). When linking the application with the libraries containing the boot
loader, a few rules must be adhered to. Follow the instructions described below.
LAPI-?BL.lib version 3.xx supports the Boot Loader with Serial/RS-232 interface only.
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