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参数资料
| 型号： | 73S8009C-32IMR/F |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 32/32页 |
| 文件大小： | 0K |
| 描述： | IC PWR MGMT/SMART CARD INT 32QFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| 应用： | 智能卡读取器，写入器 |
| 电源电压： | 2.7 V ~ 6.5 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 32-VFQFN 裸露焊盘 |
| 供应商设备封装： | 32-QFN（5x5） |
| 包装： | 带卷 (TR) |
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73S8009C Data Sheet
Revision History
DS_8009C_025
Revision
1.0
1.1
1.2
1.3
1.4
1.5
Date
2/15/2007
12/5/2007
1/21/2008
8/28/2009
1/5/2010
2/4/2010
Description
First publication.
Replaced 32QFN punched with SAWN.
Updated 32QFN package mark.
Changed the dimension of the bottom view 32-pin QFN package.
section.
Formatted to new documentation style. Miscellaneous editorial changes.
Changed the name of the “ON/OFF” pin to “ON_OFF” throughout the
document.
In Figure 1 , corrected the name of the “IOUC” pin to “I/OUC”.
In Table 1 , corrected the OFF_ACK name, pin number and type information.
In Table 7 , changed “I DDmax ” to “I VPmax ”.
At the end of Section 3.3 , added a note about using VBUS input.
In Section 3.5 , deleted “A voltage supervisor checks the value of the voltage
V CC ” and added “and 40 mA for 1.8 V cards”.
Removed all references to the 20QFN package.
Teridian Semiconductor Corporation is a registered trademark of Teridian Semiconductor Corporation.
All other trademarks are the property of their respective owners.
Simplifying System Integration is a trademark of Teridian Semiconductor Corporation.
This Data Sheet is proprietary to Teridian Semiconductor Corporation (TSC) and sets forth design goals
for the described product. The data sheet is subject to change. TSC assumes no obligation regarding
future manufacture, unless agreed to in writing. If and when manufactured and sold, this product is sold
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those
pertaining to warranty, patent infringement and limitation of liability. Teridian Semiconductor Corporation
(TSC) reserves the right to make changes in specifications at any time without notice. Accordingly, the
reader is cautioned to verify that a data sheet is current before placing orders. TSC assumes no liability
for applications assistance.
Teridian Semiconductor Corp., 6440 Oak Canyon, Suite 100, Irvine, CA 92618
TEL (714) 508-8800, FAX (714) 508-8877, http://www.teridian.com
32
Rev. 1.5
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8009C-DB | 功能描述:界面开发工具 73S8009C Demo Brd RoHS:否 制造商:Bourns 产品:Evaluation Boards 类型:RS-485 工具用于评估:ADM3485E 接口类型:RS-485 工作电源电压:3.3 V |
| 73S8009CN | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Combo ISO-7816 and USB Universal Smart Card Interface IC |
| 73S8009CN-32IM/F | 功能描述:输入/输出控制器接口集成电路 ISO7816 & USB Unvrsl Smart Card Interface RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8009CN-32IM/F1 | 功能描述:输入/输出控制器接口集成电路 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8009CN-32IMR/F | 功能描述:输入/输出控制器接口集成电路 ISO7816 & USB Unvrsl Smart Card Interface RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
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