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参数资料
型号： 73S8010R-ILR/F
厂商： Maxim Integrated Products
文件页数： 20/25页
文件大小： 0K
描述： IC SMART CARD INTERFACE 28-SOIC
产品培训模块： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装： 1,500
控制器类型： 智能卡接口
接口： I²C
电源电压： 2.7 V ~ 5.5 V
电流 - 电源： 1.5mA
工作温度： -40°C ~ 85°C
安装类型： 表面贴装
封装/外壳： 28-SOIC（0.295"，7.50mm 宽）
供应商设备封装： 28-SOIC
包装： 带卷 (TR)
73S8010R Data Sheet
DS_8010R_022
4
Rev. 1.6
Figures
Figure 1: 73S8010R Block Diagram ......................................................................................................... 2
Figure 2: 73S8010R 32-Pin QFN Pinout .................................................................................................. 5
Figure 3: 73S8010R 28-Pin SO Pinout..................................................................................................... 5
Figure 4: Typical 73S8010R Application Schematic ............................................................................... 13
Figure 5: I
2C Bus Write Protocol ............................................................................................................ 15
Figure 6: I
2C Bus Read Protocol ............................................................................................................ 16
Figure 7: I
2C Bus Timing Diagram.......................................................................................................... 16
Figure 8: Activation Sequence ............................................................................................................... 19
Figure 9: Deactivation Sequence ........................................................................................................... 20
Figure 10: Interrupt operation due to Fault and Status Conditions .......................................................... 20
Figure 11: Warm Reset Operation ......................................................................................................... 21
Figure 12: I/O Timing Diagram............................................................................................................... 21
Figure 13: 32-pin QFN Package Dimensions ......................................................................................... 22
Figure 14: 28-Pin SO Package Dimensions ........................................................................................... 23
Tables
Table 1: 73S8010R Pin Definitions .......................................................................................................... 6
Table 2: Absolute Maximum Device Ratings ............................................................................................ 8
Table 3: Recommended Operating Conditions......................................................................................... 8
Table 4: DC Smart Card Interface Requirements ..................................................................................... 9
Table 5: Digital Signals Characteristics .................................................................................................. 11
Table 6: DC Characteristics ................................................................................................................... 11
Table 7: I
2C Characteristics ................................................................................................................... 12
Table 8: Voltage / Temperature Fault Detection Circuits......................................................................... 12
Table 9: Device Address Selection ........................................................................................................ 14
Table 10: Control Register Description................................................................................................... 14
Table 11: Card Clock Rate Selection ..................................................................................................... 14
Table 12: Status Register Description .................................................................................................... 15
Table 13: I2C Bus Timing Parameters ................................................................................................... 16
Table 14: Choice of VCC Pin Capacitor ................................................................................................. 18
Table 15: Card Clock Divisor Options .................................................................................................... 18
Table 16: Order Numbers and Packaging Marks .................................................................................... 24
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相关代理商/技术参数
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73S8010R-IM/F 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16
73S8010R-IM/F1 功能描述:I2C 接口集成电路 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16
73S8010R-IM/F2 功能描述:I2C 接口集成电路 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16
73S8010R-IMR/F 功能描述:I2C 接口集成电路 Smart Card Interface ISO7816-3 & EVM4.0 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16
73S8010R-IMR/F1 功能描述:I2C 接口集成电路 RoHS:否 制造商:NXP Semiconductors 电源电压-最大:5.5 V 电源电压-最小:2.3 V 最大工作频率:400 KHz 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-16
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