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| 型号： | 73S8014RN-IL/F |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 8/28页 |
| 文件大小： | 0K |
| 描述： | IC SMART CARD 7816 EMV 20-SOIC |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 37 |
| 控制器类型： | 智能卡接口 |
| 电源电压： | 2.7 V ~ 5.5 V |
| 电流 - 电源： | 2.7mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SOIC（0.295"，7.50mm 宽） |
| 供应商设备封装： | 20-SOIC |
| 包装： | 管件 |
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73S8014RN Data Sheet
DS_8014RN_014
16
Rev. 1.0
3.5
Card Power Supply
The card power supply is internally provided by the LDO regulator, and controlled by the digital ISO-7816-3
sequencer.
3.6
On-Chip Oscillator and Card Clock
The 73S8014RN devices have an on-chip oscillator that can generate the smart card clock using an external
crystal (connected between the pins XTALIN and XTALOUT) to set the oscillator frequency. When the clock
signal is available from another source, it can be connected to the pin XTALIN, and the pin XTALOUT should be
left unconnected. The 73S8014RN is capable of generating the 4.5, 6.75 and 13.5MHz NDS clock frequencies
using a crystal or external source set at 27MHz.
The card clock frequency may be chosen between 4 different division rates, defined by digital inputs CLKDIV 1
and CLKDIV 2, as per the following table:
CLKDIV1
CLKDIV2
CLK
Max XTALIN
0
1/6
XTALIN
27MHz
0
1
XTALIN
27MHz
1
0
XTALIN
20MHz
1
XTALIN
27MHz
3.7
Activation Sequence
The 73S8014RN smart card interface ICs have an internal 10ms delay on the application of VDD where VDD >
VDDF. No activation is allowed during this 10ms period. The CMDVCC (edge triggered) signal must then be set
low to activate the card. In order to initiate activation, the card must be present; there can be no VDD fault.
The following steps show the activation sequence and the timing of the card control signals when the system
controller sets CMDVCC low while the RSTIN is low:
-
CMDVCC is set low at t0.
-
VCC will rise to the selected level and then the internal VCC control circuit checks the presence of VCC at
the end of t1. In normal operation, the voltage VCC to the card becomes valid before t1. If VCC is not valid
at t1, the OFF goes low to report a fault to the system controller, and VCC to the card is shut off.
-
Turn I/O to reception mode at t2.
-
CLK is applied to the card at t3.
-
RST is a copy of RSTIN after t3.
CMDVCC
VCC
I/O
CLK
RSTIN
t1
t2
t3
RST
t0
t1 = 0.510 ms (timing by 1.5MHz internal oscillator)
t2 = 1.5μs, I/O goes to reception state
t3 = >0.5μs, CLK starts, RST to become the copy of RSTIN
Figure 4: Activation Sequence – RSTIN Low When
CMDVCC Goes Low
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 73S8014RN-ILR/F | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface Comp w/8024 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8014RN-ILR/F1 | 功能描述:输入/输出控制器接口集成电路 Smart Card Interface Comp w/8024 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8014RN-ILR/F2 | 功能描述:输入/输出控制器接口集成电路 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8014RN-ILR/F3 | 功能描述:输入/输出控制器接口集成电路 RoHS:否 制造商:Silicon Labs 产品: 输入/输出端数量: 工作电源电压: 最大工作温度:+ 85 C 最小工作温度:- 40 C 安装风格:SMD/SMT 封装 / 箱体:QFN-64 封装:Tray |
| 73S8014RT | 制造商:TERIDIAN 制造商全称:TERIDIAN 功能描述:Smart Card Interface |
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