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| 型号： | 74AHC125PWDH |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 通用总线功能 |
| 英文描述： | Quad buffer/line driver; 3-state |
| 中文描述： | AHC SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14 |
| 封装： | 4.40 MM, PLASTIC, SOT-402-1, TSSOP-14 |
| 文件页数： | 14/16页 |
| 文件大小： | 78K |
| 代理商： | 74AHC125PWDH |
1999 Sep 27
14
Philips Semiconductors
Product specification
Quad buffer/line driver; 3-state
74AHC125; 74AHCT125
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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| 74AHC126PWDH | Quad buffer/line driver; 3-state |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 74AHC125PW-Q100,11 | 制造商:NXP Semiconductors 功能描述:Buffer/Line Driver 4-CH Non-Inverting 3-ST CMOS 14-Pin TSSOP T/R 制造商:NXP Semiconductors 功能描述:74AHC125PW-Q100/TSSOP14/REEL13 - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC BUFFER LINE DVR QUAD 14TSSOP |
| 74AHC125PW-Q100,118 | 制造商:NXP Semiconductors 功能描述: |
| 74AHC125PW-T | 功能描述:缓冲器和线路驱动器 QUAD 3-STATE BUS BUF RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel |
| 74AHC125S14-13 | 制造商:Diodes Incorporated 功能描述:IC GATE 2.5K SO14 制造商:Diodes Incorporated 功能描述:74AHC Series 5.5 V Surface Mount Quadruple 3-State Buffers OE Low - SOIC-14 制造商:Diodes Incorporated 功能描述:QUAD 3-STATE BUFFERS OE LOW 8mA VCC 4.5V |
| 74AHC125T14-13 | 制造商:Diodes Incorporated 功能描述:IC GATE 2.5K TSSOP14 制造商:Diodes Incorporated 功能描述:74AHC Series 5.5 V Surface Mount Quadruple 3-State Buffers OE Low - TSSOP-14 制造商:Diodes Incorporated 功能描述:QUAD 3-STATE BUFFERS OE LOW 8mA VCC 4.5V |
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