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参数资料
| 型号： | 74AHC257 |
| 厂商： | NXP Semiconductors N.V. |
| 英文描述： | Quad 2-input multiplexer; 3-state(四 通道2输入多路复用器（三态）；) |
| 中文描述： | 四2输入多路复用器，3态（四通道2输入多路复用器（三态）;） |
| 文件页数： | 15/20页 |
| 文件大小： | 89K |
| 代理商： | 74AHC257 |
2000 Apr 03
15
Philips Semiconductors
Product specification
Quad 2-input multiplexer; 3-state
74AHC257;
74AHCT257
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 74AHC257_08 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Quad 2-input multiplexer 3-state |
| 74AHC257D | 功能描述:编码器、解码器、复用器和解复用器 QUAD 2-INPUT MULTIPLEXER RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| 74AHC257D,112 | 功能描述:编码器、解码器、复用器和解复用器 QUAD 2-INPUT RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| 74AHC257D,118 | 功能描述:编码器、解码器、复用器和解复用器 QUAD 2-INPUT RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| 74AHC257D-Q100J | 制造商:NXP Semiconductors 功能描述:74AHC257D-Q100/SO16/REEL13// 制造商:NXP Semiconductors 功能描述:74AHC257D-Q100/SO16/REEL13// - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC MUX QUAD 2-INPUT 16SOIC |
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