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参数资料
| 型号： | 74AHCT164 |
| 厂商： | NXP Semiconductors N.V. |
| 英文描述： | 8-bit serial-in/parallel-out shift register(8位串入并出移位寄存器) |
| 中文描述： | 8位serial-in/parallel-out移位寄存器（8位串入并出移位寄存器） |
| 文件页数： | 17/20页 |
| 文件大小： | 92K |
| 代理商： | 74AHCT164 |
2000 Aug 15
17
Philips Semiconductors
Product specification
8-bit serial-in/parallel-out shift register
74AHC164; 74AHCT164
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, LFBGA, SQFP, TFBGA
HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
相关PDF资料 |
PDF描述 |
|---|---|
| 74AHC164 | 8-bit serial-in/parallel-out shift register |
| 74AHCT244 | Octal buffer/line driver; 3-state |
| 74AHC244PWDH | Octal buffer/line driver; 3-state |
| 74AHC244 | Quad 2-Input Positive-NAND Gates 14-TSSOP -40 to 85 |
| 74AHCT245 | Quadruple 2-Input Positive-AND Gates 14-SSOP -40 to 85 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 74AHCT164BQ | 制造商:NXP Semiconductors 功能描述:IC 8BIT SIPO SHIFT REG DHVQFN14 制造商:NXP Semiconductors 功能描述:IC, 8BIT, SIPO, SHIFT REG, DHVQFN14, Shift Register Function:Serial to Parallel, |
| 74AHCT164BQ,115 | 功能描述:计数器移位寄存器 5V 8-BIT S IN P OUT RoHS:否 制造商:Texas Instruments 计数器类型: 计数顺序:Serial to Serial/Parallel 电路数量:1 封装 / 箱体:SOIC-20 Wide 逻辑系列: 逻辑类型: 输入线路数量:1 输出类型:Open Drain 传播延迟时间:650 ns 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装:Reel |
| 74AHCT164BQ-G | 功能描述:计数器移位寄存器 5V 8-BIT S IN P OUT SHIFT REG RoHS:否 制造商:Texas Instruments 计数器类型: 计数顺序:Serial to Serial/Parallel 电路数量:1 封装 / 箱体:SOIC-20 Wide 逻辑系列: 逻辑类型: 输入线路数量:1 输出类型:Open Drain 传播延迟时间:650 ns 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装:Reel |
| 74AHCT164BQ-Q100X | 制造商:NXP Semiconductors 功能描述:74AHCT164BQ-Q100/DHVQFN14/REEL - Tape and Reel 制造商:NXP Semiconductors 功能描述:IC SHIFT REGISTER 8BIT 14DHVQFN |
| 74AHCT164D | 功能描述:计数器移位寄存器 8-BIT SI-PO SHIFT REGISTER RoHS:否 制造商:Texas Instruments 计数器类型: 计数顺序:Serial to Serial/Parallel 电路数量:1 封装 / 箱体:SOIC-20 Wide 逻辑系列: 逻辑类型: 输入线路数量:1 输出类型:Open Drain 传播延迟时间:650 ns 最大工作温度:+ 125 C 最小工作温度:- 40 C 封装:Reel |
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