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参数资料
| 型号： | 74AHCT1G66 |
| 厂商： | NXP Semiconductors N.V. |
| 英文描述： | Bilateral switch |
| 中文描述： | 双边开关 |
| 文件页数： | 13/16页 |
| 文件大小： | 74K |
| 代理商： | 74AHCT1G66 |
2002 May 27
13
Philips Semiconductors
Product specification
2-input NAND gate
74AHC1G00; 74AHCT1G00
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 74AHCT1G66GV | 功能描述:模拟开关 IC 3.3V SINGLE ANALOG SWITCH RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| 74AHCT1G66GV,125 | 功能描述:模拟开关 IC 3.3V SINGLE ANALOG RoHS:否 制造商:Texas Instruments 开关数量:2 开关配置:SPDT 开启电阻（最大值）:0.1 Ohms 切换电压（最大）: 开启时间（最大值）: 关闭时间（最大值）: 工作电源电压:2.7 V to 4.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:DSBGA-16 |
| 74AHCT1G66GV125 | 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| 74AHCT1G66GV-Q100H | 功能描述:IC SWITCH SPST 5TSOP 制造商:nexperia usa inc. 系列:汽车级，AEC-Q100 包装:带卷（TR） 零件状态:在售 开关电路:SPST - 常开 多路复用器/解复用器电路:1:1 电路数:1 导通电阻（最大值）:22 欧姆 通道至通道匹配（ΔRon）:- 电压 -?电源，单（V+）:4.5 V ~ 5.5 V 电压 - 电源，双（V±）:- 开关时间（Ton, Tof）（最大值）:11ns，11ns -3db 带宽:280MHz 电荷注入:- 沟道电容 （CS(off），CD（off））:10pF 电流 - 漏泄（IS（off））（最大值）:100nA 串扰:- 工作温度:-40°C ~ 125°C（TA） 封装/外壳:SC-74A，SOT-753 供应商器件封装:SC-74A 标准包装:3,000 |
| 74AHCT1G66GW | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:Bilateral switch |
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