参数资料
型号: 74AUP1G74GF,115
厂商: NXP Semiconductors
文件页数: 6/28页
文件大小: 0K
描述: IC FLIP-FLOP D POS-EDGE 8XSON
特色产品: MicroPak?
标准包装: 5,000
系列: 74AUP
功能: 设置(预设)和复位
类型: D 型
输出类型: 差分
元件数: 1
每个元件的位元数: 1
频率 - 时钟: 550MHz
延迟时间 - 传输: 2.2ns
触发器类型: 正边沿
输出电流高,低: 4mA,4mA
电源电压: 0.8 V ~ 3.6 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-XFDFN
包装: 带卷 (TR)
其它名称: 74AUP1G74GF115
74AUP1G74
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2014. All rights reserved.
Product data sheet
Rev. 9 — 6 January 2014
14 of 28
NXP Semiconductors
74AUP1G74
Low-power D-type flip-flop with set and reset; positive-edge trigger
[1]
All typical values are measured at nominal VCC.
[2]
tpd is the same as tPLH and tPHL.
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
PD =CPD VCC2 fi N+ (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(C
L VCC
2
f
o) = sum of outputs.
tW
pulse width
CP HIGH or LOW;
VCC = 1.1 V to 1.3 V
-
2.1
-
2.7
-
2.7
-
ns
VCC = 1.4 V to 1.6 V
-
1.1
-
1.5
-
1.5
-
ns
VCC = 1.65 V to 1.95 V
-
0.9
-
1.6
-
1.6
-
ns
VCC = 2.3 V to 2.7 V
-
0.6
-
1.7
-
1.7
-
ns
VCC = 3.0 V to 3.6 V
-
0.6
-
1.9
-
1.9
-
ns
SD or RD LOW;
VCC = 1.1 V to 1.3 V
-
4.2
-
11.3
-
11.5
-
ns
VCC = 1.4 V to 1.6 V
-
2.3
-
6.2
-
6.4
-
ns
VCC = 1.65 V to 1.95 V
-
1.8
-
4.8
-
5.0
-
ns
VCC = 2.3 V to 2.7 V
-
1.2
-
3.3
-
3.5
-
ns
VCC = 3.0 V to 3.6 V
-
1.1
-
2.6
-
2.8
-
ns
CPD
power
dissipation
capacitance
fi = 1 MHz;
VI =GND to VCC
VCC = 0.8 V
-
2.8
-
pF
VCC = 1.1 V to 1.3 V
-
2.9
-
pF
VCC = 1.4 V to 1.6 V
-
3.0
-
pF
VCC = 1.65 V to 1.95 V
-
3.0
-
pF
VCC = 2.3 V to 2.7 V
-
3.5
-
pF
VCC = 3.0 V to 3.6 V
-
3.9
-
pF
Table 9.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10.
Symbol Parameter
Conditions
Tamb = 25 C
Tamb = 40 C to +125 C
Unit
Min
Typ[1] Max
Min
Max
(85
C)
Min
Max
(125
C)
相关PDF资料
PDF描述
MS3451L18-9BX CONN HSG RCPT 7POS CBL MNT SCKT
VI-23P-MV-F2 CONVERTER MOD DC/DC 13.8V 150W
VI-23N-MV-F4 CONVERTER MOD DC/DC 18.5V 150W
MS3451L18-9BW CONN HSG RCPT 7POS CBL MNT SCKT
VI-23N-MV-F2 CONVERTER MOD DC/DC 18.5V 150W
相关代理商/技术参数
参数描述
74AUP1G74GM 制造商:NXP Semiconductors 功能描述:Cut Tape 制造商:NXP Semiconductors 功能描述:IC D F-F POS-EDG LOW PWR X 制造商:NXP Semiconductors 功能描述:IC, D F-F, POS-EDG, LOW PWR, XQFN8
74AUP1G74GM,125 功能描述:触发器 1.8V D-TYPE SET RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
74AUP1G74GM125 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:
74AUP1G74GM-G 功能描述:触发器 1.8V D-TYPE SET RESET +EDGE RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
74AUP1G74GN 制造商:NXP Semiconductors 功能描述:Flip Flop D-Type Pos-Edge 1-Element 8-Pin XSON T/R Bulk 制造商:NXP Semiconductors 功能描述:IC D F-F POS-EDG LOW PWR X