参数资料
型号: 74AUP1G885GF,115
厂商: NXP Semiconductors
文件页数: 1/23页
文件大小: 0K
描述: IC GATE DUAL FUNCTION 8XSON
特色产品: MicroPak?
标准包装: 5,000
系列: 74AUP
逻辑类型: 可配置多功能
电路数: 1
输入数: 3
施密特触发器输入:
输出类型: 单端
输出电流高,低: 4mA,4mA
电源电压: 0.8 V ~ 3.6 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-XFDFN
供应商设备封装: 8-XSON,SOT1089 (1.35x1)
包装: 带卷 (TR)
其它名称: 74AUP1G885GF115
1.
General description
The 74AUP1G885 provides two functions in one device. The output state of the outputs
(1Y, 2Y) is determined by the inputs (A, B and C). The output 1Y provides the Boolean
function: 1Y = A
C. The output 2Y provides the Boolean function: 2Y = A B + A C.
Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall
times across the entire VCC range from 0.8 V to 3.6 V.
This device ensures a very low static and dynamic power consumption across the entire
VCC range from 0.8 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF. The IOFF
circuitry disables the output, preventing a damaging backflow current through the device
when it is powered down.
2.
Features and benefits
Wide supply voltage range from 0.8 V to 3.6 V
High noise immunity
Complies with JEDEC standards:
JESD8-12 (0.8 V to 1.3 V)
JESD8-11 (0.9 V to 1.65 V)
JESD8-7 (1.2 V to 1.95 V)
JESD8-5 (1.8 V to 2.7 V)
JESD8-B (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F Class 3A exceeds 5000 V
MM JESD22-A115-A exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Low static power consumption; ICC = 0.9 A (maximum)
Latch-up performance exceeds 100 mA per JESD78 Class II
Inputs accept voltages up to 3.6 V
Low noise overshoot and undershoot < 10 % of VCC
IOFF circuitry provides partial Power-down mode operation
Multiple package options
Specified from
40 Cto+85 C and 40 Cto+125 C
74AUP1G885
Low-power dual function gate
Rev. 9 — 31 January 2013
Product data sheet
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74AUP1G885GM-G 功能描述:逻辑门 1.8V LOW-PWR 2-FUNCTION GATE RoHS:否 制造商:Texas Instruments 产品:OR 逻辑系列:LVC 栅极数量:2 线路数量(输入/输出):2 / 1 高电平输出电流:- 16 mA 低电平输出电流:16 mA 传播延迟时间:3.8 ns 电源电压-最大:5.5 V 电源电压-最小:1.65 V 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:DCU-8 封装:Reel
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