- 您现在的位置：买卖IC网 > PDF目录8070 > 74AVCH16244DGG,112 (NXP Semiconductors)IC BUFF DVR TRI-ST 16BIT 48TSSOP PDF资料下载
参数资料
| 型号： | 74AVCH16244DGG,112 |
| 厂商： | NXP Semiconductors |
| 文件页数： | 5/16页 |
| 文件大小： | 0K |
| 描述： | IC BUFF DVR TRI-ST 16BIT 48TSSOP |
| 产品培训模块： | Logic Packages |
| 标准包装： | 39 |
| 系列： | 74AVCH |
| 逻辑类型： | 缓冲器/线路驱动器，非反相 |
| 元件数： | 4 |
| 每个元件的位元数： | 4 |
| 输出电流高，低： | 12mA，12mA |
| 电源电压： | 1.2 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 48-TFSOP（0.240"，6.10mm 宽） |
| 供应商设备封装： | 48-TSSOP |
| 包装： | 管件 |
| 其它名称： | 935266778112 |
2000 Mar 07
13
Philips Semiconductors
Product Specication
16-bit buffer/line driver; 3.6 V tolerant;
3-state
74AVCH16244
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
BGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, SMS
not suitable(2)
suitable
PLCC(3), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
Data sheet status
Objective specication
This data sheet contains target or goal specications for product development.
Preliminary specication
This data sheet contains preliminary data; supplementary data may be published later.
Product specication
This data sheet contains nal product specications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specication
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specication.
相关PDF资料 |
PDF描述 |
|---|---|
| IDT74ALVCH32245BFG8 | IC TRANSCVR TRI-ST 32BIT 96LFBGA |
| IDT74ALVCH32245BF8 | IC TRANSCVR TRI-ST 32BIT 96LFBGA |
| IDT74ALVCH32244BFG8 | IC BUFF DVR TRI-ST 32BIT 96LFBGA |
| IDT74ALVCH32244BF8 | IC BUFF DVR TRI-ST 32BIT 96LFBGA |
| 74LVCH16244AEV,151 | IC BUFF DVR TRI-ST 16BIT 56VFBGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 74AVCH16244DG-T | 功能描述:缓冲器和线路驱动器 16-BIT BUF 3-STATE RoHS:否 制造商:Micrel 输入线路数量:1 输出线路数量:2 极性:Non-Inverting 电源电压-最大:+/- 5.5 V 电源电压-最小:+/- 2.37 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Reel |
| 74AVCH16245 | 制造商:PHILIPS 制造商全称:NXP Semiconductors 功能描述:16-bit transceiver with direction pin; 3.6 V tolerant; 3-state |
| 74AVCH16245DG | 功能描述:总线收发器 16-BIT TRANSCVR 3-S RoHS:否 制造商:Fairchild Semiconductor 逻辑类型:CMOS 逻辑系列:74VCX 每芯片的通道数量:16 输入电平:CMOS 输出电平:CMOS 输出类型:3-State 高电平输出电流:- 24 mA 低电平输出电流:24 mA 传播延迟时间:6.2 ns 电源电压-最大:2.7 V, 3.6 V 电源电压-最小:1.65 V, 2.3 V 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-48 封装:Reel |
| 74AVCH16245DGG | 制造商:未知厂家 制造商全称:未知厂家 功能描述:BUS TRANSCEIVER|DUAL|8-BIT|AVC/ALVC-CMOS|TSSOP|48PIN|PLASTIC |
| 74AVCH16245DGG,112 | 功能描述:总线收发器 IC TRANSCVR TRI-ST 16BIT RoHS:否 制造商:Fairchild Semiconductor 逻辑类型:CMOS 逻辑系列:74VCX 每芯片的通道数量:16 输入电平:CMOS 输出电平:CMOS 输出类型:3-State 高电平输出电流:- 24 mA 低电平输出电流:24 mA 传播延迟时间:6.2 ns 电源电压-最大:2.7 V, 3.6 V 电源电压-最小:1.65 V, 2.3 V 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-48 封装:Reel |
发布紧急采购，3分钟左右您将得到回复。