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参数资料
| 型号： | 74HCT4066U |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 多路复用及模拟开关 |
| 英文描述： | QUAD 1-CHANNEL, SGL POLE SGL THROW SWITCH, UUC |
| 文件页数： | 16/24页 |
| 文件大小： | 139K |
| 代理商： | 74HCT4066U |
1998 Nov 10
23
Philips Semiconductors
Product specication
Quad bilateral switches
74HC/HCT4066
Suitability of IC packages for wave, reow and dipping soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
MOUNTING
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
suitable(2)
suitable
Surface mount
HLQFP, HSQFP, HSOP, SMS
not suitable(3)
suitable
PLCC(4), SO
suitable
LQFP, QFP, TQFP
not recommended(4)(5)
suitable
SQFP
not suitable
suitable
SSOP, TSSOP, VSO
not recommended(6)
suitable
Data sheet status
Objective specication
This data sheet contains target or goal specications for product development.
Preliminary specication
This data sheet contains preliminary data; supplementary data may be published later.
Product specication
This data sheet contains nal product specications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specication
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specication.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 74HCT4067BQ | 制造商:NXP Semiconductors 功能描述:IC 16-CH MUX/DEMUX DHVQFN24 |
| 74HCT4067BQ,115 | 功能描述:多路器开关 IC 16-CHANNEL ANALOG MUX/DEMUX RoHS:否 制造商:Texas Instruments 通道数量:1 开关数量:4 开启电阻（最大值）:7 Ohms 开启时间（最大值）: 关闭时间（最大值）: 传播延迟时间:0.25 ns 工作电源电压:2.3 V to 3.6 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UQFN-16 |
| 74HCT4067BQ,118 | 功能描述:编码器、解码器、复用器和解复用器 Analog MUX Single 16:1 5.5V 24-Pin RoHS:否 制造商:Micrel 产品:Multiplexers 逻辑系列:CMOS 位数: 线路数量（输入/输出）:2 / 12 传播延迟时间:350 ps, 400 ps 电源电压-最大:2.625 V, 3.6 V 电源电压-最小:2.375 V, 3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:QFN-44 封装:Tray |
| 74HCT4067BQ-G | 功能描述:多路器开关 IC 16-CHANNEL ANALOG MUX/DEMUX RoHS:否 制造商:Texas Instruments 通道数量:1 开关数量:4 开启电阻（最大值）:7 Ohms 开启时间（最大值）: 关闭时间（最大值）: 传播延迟时间:0.25 ns 工作电源电压:2.3 V to 3.6 V 工作电源电流: 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UQFN-16 |
| 74HCT4067BQ-Q100J | 功能描述:1 Circuit IC Switch 16:1 120 Ohm 24-DHVQFN (5.5x3.5) 制造商:nxp semiconductors 系列:汽车级，AEC-Q100 包装:带卷（TR） 零件状态:有效 开关电路:- 多路复用器/解复用器电路:16:1 电路数:1 导通电阻（最大值）:120 欧姆 通道至通道匹配（ΔRon）:6 欧姆 电压 -?电源，单（V+）:4.5 V ~ 5.5 V 电压 - 电源，双（V±）:- 开关时间（Ton, Tof）（最大值）:65ns，60ns -3db 带宽:100MHz 电荷注入:- 沟道电容 （CS(off），CD（off））:3.5pF 电流 - 漏泄（IS（off））（最大值）:800nA 串扰:- 工作温度:-40°C ~ 125°C（TA） 封装/外壳:24-VFQFN 裸露焊盘 供应商器件封装:24-DHVQFN（5.5x3.5） 标准包装:3,000 |
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