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参数资料
| 型号： | 74LCX16500MTDX |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 1/10页 |
| 文件大小： | 0K |
| 描述： | TXRX 18BIT UNIV BUS LV 56TSSOP |
| 标准包装： | 1,000 |
| 系列： | 74LCX |
| 逻辑类型： | 通用总线收发器 |
| 电路数： | 18 位 |
| 输出电流高，低： | 24mA，24mA |
| 电源电压： | 2 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 56-TFSOP（0.240"，6.10mm 宽） |
| 供应商设备封装： | 56-TSSOP |
| 包装： | 带卷 (TR) |
2002 Fairchild Semiconductor Corporation
DS012407
www.fairchildsemi.com
March 1995
Revised June 2002
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74LCX16500
Low Voltage 18-Bit Universal Bus Transceivers with
5V Tolerant Inputs and Outputs
General Description
These 18-bit universal bus transceivers combine D-type
latches and D-type flip-flops to allow data flow in transpar-
ent, latched, and clocked modes.
Data flow in each direction is controlled by output-enable
(OEAB and OEBA), latch-enable (LEAB and LEBA), and
clock (CLKAB and CLKBA) inputs.
The LCX16500 is designed for low voltage (2.5V or 3.3V)
VCC applications with the capability of interfacing to a 5V
signal environment.
The LCX16500 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power.
Features
s 5V tolerant inputs and outputs
s 2.3V–3.6V VCC specifications provided
s 6.0 ns tPD max (VCC = 3.3V), 20 A ICC max
s Power down high impedance inputs and outputs
s Supports live insertion/withdrawal (Note 1)
s
±24 mA output drive (V
CC = 3.0V)
s Latch-up performance exceeds 500 mA
s ESD performance:
Human body model
> 2000V
Machine model
> 200V
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to VCC and OE tied to GND through a resistor: the minimum
value or the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Note 2: Ordering code “G” indicates Trays.
Note 3: Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Order Number
Package Number
Package Description
74LCX16500G
(Note 2)(Note 3)
BGA54A
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LCX16500MEA
(Note 3)
MS56A
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LCX16500MTD
(Note 3)
MTD56
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
s Uses proprietary noise/EMI reduction circuitry
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 74LCX16501 | 制造商:FAIRCHILD 制造商全称:Fairchild Semiconductor 功能描述:Low Voltage 18-Bit Universal Bus Transceivers with 5V Tolerant Inputs and Outputs |
| 74LCX16501MEA | 功能描述:总线收发器 18-Bit Univ Bus Tran RoHS:否 制造商:Fairchild Semiconductor 逻辑类型:CMOS 逻辑系列:74VCX 每芯片的通道数量:16 输入电平:CMOS 输出电平:CMOS 输出类型:3-State 高电平输出电流:- 24 mA 低电平输出电流:24 mA 传播延迟时间:6.2 ns 电源电压-最大:2.7 V, 3.6 V 电源电压-最小:1.65 V, 2.3 V 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-48 封装:Reel |
| 74LCX16501MEA_Q | 功能描述:总线收发器 18-Bit Univ Bus Tran RoHS:否 制造商:Fairchild Semiconductor 逻辑类型:CMOS 逻辑系列:74VCX 每芯片的通道数量:16 输入电平:CMOS 输出电平:CMOS 输出类型:3-State 高电平输出电流:- 24 mA 低电平输出电流:24 mA 传播延迟时间:6.2 ns 电源电压-最大:2.7 V, 3.6 V 电源电压-最小:1.65 V, 2.3 V 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-48 封装:Reel |
| 74LCX16501MEAX | 功能描述:总线收发器 18-Bit Univ Bus Tran RoHS:否 制造商:Fairchild Semiconductor 逻辑类型:CMOS 逻辑系列:74VCX 每芯片的通道数量:16 输入电平:CMOS 输出电平:CMOS 输出类型:3-State 高电平输出电流:- 24 mA 低电平输出电流:24 mA 传播延迟时间:6.2 ns 电源电压-最大:2.7 V, 3.6 V 电源电压-最小:1.65 V, 2.3 V 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-48 封装:Reel |
| 74LCX16501MTD | 功能描述:总线收发器 18-Bit Univ Bus Tran RoHS:否 制造商:Fairchild Semiconductor 逻辑类型:CMOS 逻辑系列:74VCX 每芯片的通道数量:16 输入电平:CMOS 输出电平:CMOS 输出类型:3-State 高电平输出电流:- 24 mA 低电平输出电流:24 mA 传播延迟时间:6.2 ns 电源电压-最大:2.7 V, 3.6 V 电源电压-最小:1.65 V, 2.3 V 最大工作温度:+ 85 C 封装 / 箱体:TSSOP-48 封装:Reel |
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