参数资料
型号: 74LCX245WMX
厂商: Fairchild Semiconductor
文件页数: 1/11页
文件大小: 0K
描述: IC TRANSCVR BIDIR 8BIT 20SOIC
标准包装: 1
系列: 74LCX
逻辑类型: 收发器,非反相
元件数: 1
每个元件的位元数: 8
输出电流高,低: 24mA,24mA
电源电压: 2 V ~ 3.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
供应商设备封装: 20-SOIC
包装: 标准包装
产品目录页面: 1211 (CN2011-ZH PDF)
其它名称: 74LCX245WMXDKR
74LCX245
Lo
w
V
olta
g
e
Bidirectional
T
ransceiver
with
5V
T
olerant
Inputs
and
Outputs
1994 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LCX245 Rev. 1.11.1
74LCX245
Low Voltage Bidirectional Transceiver with 5V Tolerant
Inputs and Outputs
Features
5V tolerant inputs and outputs
2.3V to 3.6V VCC specifications provided
7.0ns tPD max. (VCC = 3.3V), 10A ICC max.
Power down high impedance inputs and outputs
Supports live insertion/withdrawal(1)
±24mA output drive (VCC = 3.0V)
Latch-up performance exceeds 500mA
ESD performance:
– Human body model
> 2000V
– Machine model
> 200V
Leadless DQFN package
Note:
1. To ensure the high-impedance state during power up
or down, OE should be tied to VCC through a pull-up
resistor: the minimum value or the resistor is
determined by the current-sourcing capability of the
driver.
General Description
The LCX245 contains eight non-inverting bidirectional
buffers with 3-STATE outputs and is intended for bus
oriented applications. The device is designed for low
voltage (2.5V and 3.3V) VCC applications with capability
of interfacing to a 5V signal environment. The T/R input
determines the direction of data flow through the device.
The OE input disables both the A and B ports by placing
them in a high impedance state.
The LCX245 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintain-
ing CMOS low power dissipation.
Ordering Information
Note:
2. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order Number
Package
Number
Package Description
74LCX245WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX245SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX245BQX(2)
MLP20B
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),
JEDEC MO-241, 2.5 x 4.5mm
74LCX245MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX245MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
Implements proprietary noise/EMI reduction circuitry
December 2013
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