参数资料
| 型号： | 74LCX374SJ |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 1/15页 |
| 文件大小： | 0K |
| 描述： | IC FLIP FLOP OCT D LV 20SOP |
| 标准包装： | 38 |
| 系列： | 74LCX |
| 功能： | 标准 |
| 类型： | D 型总线 |
| 输出类型： | 三态非反相 |
| 元件数： | 1 |
| 每个元件的位元数： | 8 |
| 频率 - 时钟： | 150MHz |
| 延迟时间 - 传输： | 8.5ns |
| 触发器类型： | 正边沿 |
| 输出电流高，低： | 24mA，24mA |
| 电源电压： | 2 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 20-SOIC（0.209"，5.30mm 宽） |
| 包装： | 管件 |
74LCX374
—
Lo
w
V
olta
g
e
Octal
D-T
ype
Flip-Flop
with
5V
T
olerant
Inputs
and
Outputs
2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LCX374 Rev. 1.6.1
74LCX374
Low Voltage Octal D-Type Flip-Flop
with 5V Tolerant Inputs and Outputs
Features
■ 5V tolerant inputs and outputs
■ 2.3V–3.6V VCC specifications provided
■ 8.5ns tPD max (VCC = 3.3V), 10A ICC max
■ Power-down high impedance inputs and outputs
■ Supports live insertion/withdrawal(1)
■ ±24mA output drive (VCC = 3.0V)
■
■ Latch-up performance exceeds JEDEC 78 conditions
■ ESD performance
– Human Body Model
> 2000V
– Machine Model
> 200V
■ Leadless DQFN package
Note:
1. To ensure the high impedance state during power up
or down, OE should be tied to VCC through a pull-up
resistor: the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
General Description
The LCX374 consists of eight D-type flip-flops featuring
separate D-type inputs for each flip-flop and 3-STATE
outputs for bus-oriented applications. A buffered clock
(CP) and Output Enable (OE) are common to all flip-
flops. The LCX374 is designed for low voltage appli-
cations with capability of interfacing to a 5V signal
environment.
The LCX374 is fabricated with an advanced CMOS
technology to achieve high speed operation while main-
taining CMOS low power dissipation.
Ordering Information
Note:
2. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order Number
Package
Number
Package Description
74LCX374WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300"
Wide
74LCX374SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX374BQX(2)
MLP20B
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN),
JEDEC MO-241, 2.5 x 4.5mm
74LCX374MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm
Wide
74LCX374MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
Implements proprietary noise/EMI reduction circuitry
December 2013
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 74LCX374SJ_Q | 功能描述:触发器 Oct D-Type Flip-Flop RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel |
| 74LCX374SJX | 功能描述:触发器 Oct D-Type Flip-Flop RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel |
| 74LCX374T | 制造商:STMICROELECTRONICS 制造商全称:STMicroelectronics 功能描述:OCTAL D-TYPE FLIP FLOP NON INVERTING 3-STATE WITH 5V TOLERANT INPUTS AND OUTPUTS |
| 74LCX374TTR | 功能描述:触发器 Quad "D" Latch RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel |
| 74LCX374WM | 功能描述:触发器 Oct D-Type Flip-Flop RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel |
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