参数资料
型号: 74LVC2G74GF,115
厂商: NXP Semiconductors
文件页数: 2/20页
文件大小: 0K
描述: IC FLIP-FLOP SGL D S/R XSON8
特色产品: MicroPak?
标准包装: 1
系列: 74LVC
功能: 设置(预设)和复位
类型: D 型
输出类型: 差分
元件数: 1
每个元件的位元数: 1
频率 - 时钟: 200MHz
延迟时间 - 传输: 2.5ns
触发器类型: 正边沿
输出电流高,低: 32mA,32mA
电源电压: 1.65 V ~ 5.5 V
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 8-XFDFN
包装: 标准包装
其它名称: 568-5477-6
74LVC2G74
All information provided in this document is subject to legal disclaimers.
NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 10 — 2 April 2013
10 of 25
NXP Semiconductors
74LVC2G74
Single D-type flip-flop with set and reset; positive edge trigger
[1]
Typical values are measured at Tamb =25 C and VCC = 1.8 V, 2.5 V, 2.7 V, 3.3 V and 5.0 V respectively.
[2]
tpd is the same as tPLH and tPHL.
[3]
CPD is used to determine the dynamic power dissipation (PD in W).
PD =CPD VCC2 fi N+ (CL VCC2 fo) where:
fi = input frequency in MHz;
fo = output frequency in MHz;
CL = output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(C
L VCC
2
f
o) = sum of outputs.
trec
recovery time
SD or RD; see Figure 9
VCC = 1.65 V to 1.95 V
1.9
-
1.9
-
ns
VCC = 2.3 V to 2.7 V
1.4
-
1.4
-
ns
VCC = 2.7 V
1.3
-
1.3
-
ns
VCC = 3.0 V to 3.6 V
+1.2
3.0
-
+1.2
-
ns
VCC = 4.5 V to 5.5 V
1.0
-
1.0
-
ns
tsu
set-up time
D to CP; see Figure 8
VCC = 1.65 V to 1.95 V
2.9
-
2.9
-
ns
VCC = 2.3 V to 2.7 V
1.7
-
1.7
-
ns
VCC = 2.7 V
1.7
-
1.7
-
ns
VCC = 3.0 V to 3.6 V
1.3
0.5
-
1.3
-
ns
VCC = 4.5 V to 5.5 V
1.1
-
1.1
-
ns
th
hold time
D to CP; see Figure 8
VCC = 1.65 V to 1.95 V
1.5
-
1.5
-
ns
VCC = 2.3 V to 2.7 V
1.0
-
1.0
-
ns
VCC = 2.7 V
1.0
-
1.0
-
ns
VCC = 3.0 V to 3.6 V
1.0
0.6
-
1.0
-
ns
VCC = 4.5 V to 5.5 V
1.0
-
1.0
-
ns
fmax
maximum
frequency
CP; see Figure 8
VCC = 1.65 V to 1.95 V
80
-
80
-
MHz
VCC = 2.3 V to 2.7 V
175
-
175
-
MHz
VCC = 2.7 V
175
-
175
-
MHz
VCC = 3.0 V to 3.6 V
175
280
-
175
-
MHz
VCC = 4.5 V to 5.5 V
200
-
200
-
MHz
CPD
power dissipation
capacitance
VI = GND to VCC;
VCC =3.3 V
-15-
-
pF
Table 9.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V); for test circuit see Figure 10.
Symbol Parameter
Conditions
40 C to +85 C
40 C to +125 C
Unit
Min
Typ[1]
Max
Min
Max
相关PDF资料
PDF描述
TXR21AB45-2214BI ADPTR TINEL LOCK ANG SHELL 22
VI-B4W-MU-F1 CONVERTER MOD DC/DC 5.5V 200W
TXR21AB90-2212AI ADPTR TINEL LOCK ANG SHELL 22
VI-B40-MU-F3 CONVERTER MOD DC/DC 5V 200W
VI-B40-MU-F2 CONVERTER MOD DC/DC 5V 200W
相关代理商/技术参数
参数描述
74LVC2G74GM 制造商:NXP Semiconductors 功能描述:IC D FLIP-FLOP POS EDGE XQF
74LVC2G74GM,125 功能描述:触发器 3.3V SGL D SET RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
74LVC2G74GM125 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述:
74LVC2G74GM-G 功能描述:触发器 3.3V SGL D SET RST +ED TRIG RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
74LVC2G74GN 制造商:NXP Semiconductors 功能描述:IC D FLIP-FLOP POS EDGE XSO