参数资料
型号: 74LVT16373MTDX
厂商: Fairchild Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: IC LATCH TRANSP 16BIT 48TSSOP
标准包装: 1,000
系列: 74LVT
逻辑类型: D 型透明锁存器
电路: 8:8
输出类型: 三态
电源电压: 2.7 V ~ 3.6 V
独立电路: 2
延迟时间 - 传输: 1.5ns
输出电流高,低: 32mA,64mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 48-TFSOP(0.240",6.10mm 宽)
供应商设备封装: 48-TSSOP
包装: 带卷 (TR)
2005 Fairchild Semiconductor Corporation
DS012021
www.fairchildsemi.com
January 1999
Revised June 2005
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74LVT16373 74LVTH16373
Low Voltage 16-Bit Transparent Latch
with 3-STATE Outputs
General Description
The LVT16373 and LVTH16373 contain sixteen non-invert-
ing latches with 3-STATE outputs and is intended for bus
oriented applications. The device is byte controlled. The
flip-flops appear transparent to the data when the Latch
Enable (LE) is HIGH. When LE is LOW, the data that meets
the setup time is latched. Data appears on the bus when
the Output Enable (OE) is LOW. When OE is HIGH, the
outputs are in a high impedance state.
The LVTH16373 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These latches are designed for low-voltage (3.3V) VCC
applications, but with the capability to provide a TTL inter-
face to a 5V environment. The LVT16373 and LVTH16373
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining a low power dissipation.
Features
s Input and output interface capability to systems at
5V VCC
s Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16373),
also available without bushold feature (74LVT16373)
s Live insertion/extraction permitted
s Power Up/Power Down high impedance provides
glitch-free bus loading
s Outputs source/sink
32 mA/64 mA
s Functionally compatible with the 74 series 16373
s Latch-up performance exceeds 500 mA
s ESD performance:
Human-body model
! 2000V
Machine model
! 200V
Charged-device model
! 1000V
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA) (Preliminary)
Ordering Code:
Note 1: BGA package available in Tape and Reel only.
Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
Order Number
Package Number
Package Description
74LVT16373GX
(Note 1)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74LVT16373MEA
(Note 2)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVT16373MTD
(Note 2)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH16373GX
(Note 1)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[TAPE and REEL]
74LVTH16373MEA
(Note 2)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVTH16373MTD
(Note 2)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
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74LVT16374ADGG,118 功能描述:触发器 IC 16BIT EDG-TRIG D FF RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
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