参数资料
型号: 74LVT16374MTD
厂商: Fairchild Semiconductor
文件页数: 1/8页
文件大小: 0K
描述: IC FLIP FLOP 16BIT D 3ST 48TSSOP
标准包装: 38
系列: 74LVT
功能: 标准
类型: D 型总线
输出类型: 三态非反相
元件数: 2
每个元件的位元数: 8
频率 - 时钟: 160MHz
延迟时间 - 传输: 4.5ns
触发器类型: 正边沿
输出电流高,低: 32mA,64mA
电源电压: 2.7 V ~ 3.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 48-TFSOP(0.240",6.10mm 宽)
包装: 管件
2005 Fairchild Semiconductor Corporation
DS012022
www.fairchildsemi.com
January 1999
Revised June 2005
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74LVT16374 74LVTH16374
Low Voltage 16-Bit D-Type Flip-Flop
with 3-STATE Outputs
General Description
The LVT16374 and LVTH16374 contain sixteen non-invert-
ing D-type flip-flops with 3-STATE outputs and is intended
for bus oriented applications. The device is byte controlled.
A buffered clock (CP) and Output Enable (OE) are com-
mon to each byte and can be shorted together for full 16-bit
operation.
The LVTH16374 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These flip-flops are designed for low-voltage (3.3V) VCC
applications, but with the capability to provide a TTL inter-
face to a 5V environment. The LVT16374 and LVTH16374
are fabricated with an advanced BiCMOS technology to
achieve high speed operation similar to 5V ABT while
maintaining a low power dissipation.
Features
s Input and output interface capability to systems at
5V VCC
s Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH16374),
also available without bushold feature (74LVT16374)
s Live insertion/extraction permitted
s Power Up/Power Down high impedance provides
glitch-free bus loading
s Outputs source/sink
32 mA/64 mA
s Functionally compatible with the 74 series 16374
s Latch-up performance exceeds 500 mA
s ESD performance:
Human-body model
! 2000V
Machine model
! 200V
Charged-device model
! 1000V
s Also packaged in plastic Fine-Pitch Ball Grid Array
(FBGA)
Ordering Code:
Note 1: Ordering code “G” indicates Trays.
Note 2: Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
Logic Symbol
Order Number
Package Number
Package Description
74LVT16374G
(Note 1)(Note 2)
BGA54A
(Preliminary)
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVT16374MEA
(Note 2)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVT16374MTD
(Note 2)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
74LVTH16374G
(Note 1)(Note 2)
BGA54A
54-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
74LVTH16374MEA
(Note 2)
MS48A
48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide
74LVTH16374MTD
(Note 2)
MTD48
48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
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