参数资料
型号: 74LVT373WMX
厂商: Fairchild Semiconductor
文件页数: 1/10页
文件大小: 0K
描述: IC LATCH TRANSP OCT 3ST 20SOIC
标准包装: 1,000
系列: 74LVT
逻辑类型: D 型透明锁存器
电路: 8:8
输出类型: 三态
电源电压: 2.7 V ~ 3.6 V
独立电路: 1
延迟时间 - 传输: 1.5ns
输出电流高,低: 32mA,64mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 20-SOIC(0.295",7.50mm 宽)
供应商设备封装: 20-SOIC
包装: 带卷 (TR)
74L
VT373,
74L
VTH373
Lo
w
V
olta
g
e
Octal
T
ransparent
Latc
h
with
3-ST
A
TE
Outputs
1999 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LVT373, 74LVTH373 Rev. 1.5.0
February 2008
74LVT373, 74LVTH373
Low Voltage Octal Transparent Latch with 3-STATE Outputs
Features
Input and output interface capability to systems at
5V VCC
Bushold data inputs eliminate the need for external
pull-up resistors to hold unused inputs (74LVTH373),
also available without bushold feature (74LVT373)
Live insertion/extraction permitted
Power Up/Down high impedance provides glitch-free
bus loading
Outputs source/sink –32 mA/+64 mA
Functionally compatible with the 74 series 373
ESD performance:
– Human-body model
> 2000V
– Machine model
> 200V
– Charged-device model
> 1000V
General Description
The LVT373 and LVTH373 consist of eight latches with
3-STATE outputs for bus organized system applications.
The latches appear transparent to the data when Latch
Enable (LE) is HIGH. When LE is LOW, the data satisfy-
ing the input timing requirements is latched. Data
appears on the bus when the Output Enable (OE) is
LOW. When OE is HIGH, the bus output is in a high
impedance state.
The LVTH373 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These octal latches are designed for low-voltage (3.3V)
VCC applications, but with the capability to provide a TTL
interface to a 5V environment. The LVT373 and
LVTH373 are fabricated with an advanced BiCMOS
technology to achieve high speed operation similar to 5V
ABT while maintaining low power dissipation.
Ordering Information
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order Number
Package
Number
Package Description
74LVT373WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVT373SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVT373MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
74LVTH373WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LVTH373SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LVTH373MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
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74LVT374D 功能描述:触发器 3.3V OCT D-TYPE 3-S RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel
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74LVT374D,118 功能描述:触发器 3.3V OCT D-TYPE 3-S RoHS:否 制造商:Texas Instruments 电路数量:2 逻辑系列:SN74 逻辑类型:D-Type Flip-Flop 极性:Inverting, Non-Inverting 输入类型:CMOS 输出类型: 传播延迟时间:4.4 ns 高电平输出电流:- 16 mA 低电平输出电流:16 mA 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:X2SON-8 封装:Reel