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参数资料
| 型号： | 796037 |
| 厂商： | Multicore |
| 文件页数： | 1/2页 |
| 文件大小： | 0K |
| 描述： | 97SC C511 2% .015DIA/28SWG |
| 标准包装： | 40 |
| 系列： | C511™ |
| 制程： | 无铅 |
| 类型： | 焊线 |
| 焊剂类型： | 中性活性松香（RMA） |
| 复合体： | Sn96.5Ag3.0Cu0.5（96.5/3/0.5） |
| 线规： | 28 |
| 直径： | 0.015" (0.39mm) |
| 芯体尺寸： | 2% |
| 其它名称： | 796307 82-109 |
Technical Data Sheet
C511?
October - 2009
PRODUCT DESCRIPTION
C511? provides the following product characteristics:
Technology Cored solder wire
Activity High
Product Benefits ? No clean
Soldering Iron:
● Good results can be obtained using a range of tip
temperatures. However, the optimum tip temperature and
heat capacity required for a hand-soldering process is a
function of both soldering iron design and the nature of
the task.
IPC/J-STD-004
Classification
Application
Surface Finishes
? Clear residue
? Good wetting
? Fast soldering
? Heat stable
? Mild odor
? Pb-free and SnPb alloys available
ROM1
Soldering - Cored wire
Copper, Brass and Nickel
● Care should be exercised to avoid unnecessarily high tip
temperatures for extensive periods of time.
● A high tip temperature may increase any tendency to flux
spitting and it may produce some residue darkening.
● The tip of the soldering iron should be properly tinned.
Severely contaminated soldering iron tips should be
cleaned with Multicore? Tip Tinner/Cleaner.
● Wipe the tip on a clean, damp sponge before re-tinning
with C511? wire.
Soldering Process:
C511? cored solder wire has been specially formulated to
complement no clean wave and reflow soldering processes.
TYPICAL PROPERTIES
Solder Wire - Cored Typical Properties
Alloys - Tin/lead ? SN63
? SN60
? SN62
Alloys - Lead Free ? 96SC (SAC387)
? 97SC (SAC305)
? 99C (SnCu)
1. Apply the soldering iron tip to the work surface. The iron
tip should contact both the base material and the lead at
the same time to heat both surfaces properly. It should
take no more than a fraction of a second to heat both
surfaces adequately.
2. Apply C511? flux cored wire to a part of the joint surface
away from the soldering iron and allow to form a joint
fillet. This will be virtually instantaneous. Do not apply
excessive solder to the joint as this will not improve joint
integrity and it will leave excess flux residues on the
surface.
3. Remove solder from the work piece and then remove the
iron tip.
Acid Value
? 95A (SnSb)
? 96S (SnAg)
164 to 176 mg KOH/g
4. The total process will be very rapid, depending upon
thermal mass, tip temperature, tip configuration and the
solderability of the surfaces to be joined.
Halide content 1.1%
Flux Content (%) 2.7
ALLOYS:
The alloys used in C511? cored solder wires conform to the
purity requirements of the common national and international
standards.
FLUX:
C511? solid flux is based on modified rosin and carefully
selected activators. In practice they exhibit a mild rosin odor
and leave a small quantity of clear residue.
DIRECTIONS FOR USE
Soldering with C511? does not require any special methods
or deviation from standard hand soldering practices.
5. The resin and flux systems are designed to leave
relatively low residues and to minimize residual activity.
This is achieved by ensuring some decomposition and
volatilization takes place during the soldering process
Cleaning:
C511? flux cored solder wire has been formulated to leave
amber flux residues and resist spitting and fuming. In most
industrial and consumer electronics applications, cleaning will
not be required. The product may, therefore, be used to
complement a no-clean wave soldering or reflow process or to
allow repairs to cleaned boards without the need for a second
cleaning process. In high-reliability applications, the residues
should be removed.
Should cleaning be required, this is best achieved using
SC-01? cleaner.
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