参数资料
型号: 843004AGI-01T
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: 时钟产生/分配
英文描述: 170 MHz, OTHER CLOCK GENERATOR, PDSO24
封装: 4.40 X 7.80 MM, 0.925 MM HEIGHT, MO-153, TSSOP-24
文件页数: 6/19页
文件大小: 1414K
代理商: 843004AGI-01T
ICS843004AGI-01 REVISION B MARCH 24, 2011
14
2011Integrated Device Technology, Inc.
ICS843004I-01 Data Sheet
FEMTOCLOCK CRYSTAL-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER
Power Considerations
This section provides information on power dissipation and junction temperature for the ICS843004I-01.
Equations and example calculations are also provided.
1.
Power Dissipation.
The total power dissipation for the ICS843004I-01 is the sum of the core power plus the power dissipated in the load(s).
The following is the power dissipation for VCC= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 130mA = 450.45mW
Power (outputs)MAX = 30mW/Loaded Output pair
If all outputs are loaded, the total power is 4 * 30mW = 120mW
Total Power_MAX (3.465V, with all outputs switching) = 450.45mW + 120mW = 570.45mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
θ
JA * Pd_total + TA
Tj = Junction Temperature
θ
JA = Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
TA = Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
θ
JA must be used. Assuming a moderate air
flow of 1 meter per second and a multi-layer board, the appropriate value is 65°C/W per Table 6 below.
Therefore, Tj for an ambient temperature of 85°C with all outputs switching is:
85°C + 0.570W * 65°C/W = 122°C. This is below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 6. Thermal Resistance θJA for 24 Lead TSSOP, Forced Convection
θ
JA vs. Air Flow
Meters per Second
01
2.5
Multi-Layer PCB, JEDEC Standard Test Boards
70°C/W
65°C/W
62°C/W
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