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参数资料
| 型号： | 933740730118 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 显示驱动器 |
| 英文描述： | LIQUID CRYSTAL DISPLAY DRIVER, PDSO56 |
| 封装： | PLASTIC, VSOP-56 |
| 文件页数： | 28/44页 |
| 文件大小： | 192K |
| 代理商： | 933740730118 |
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2001 Oct 02
34
Philips Semiconductors
Product specication
Universal LCD driver for low multiplex rates
PCF8576
12.1
Chip-on-glass cascadability in single plane
In chip-on-glass technology, where driver devices are
bonded directly onto glass of the LCD, it is important that
the devices may be cascaded without the crossing of
conductors, but the paths of conductors can be continued
on the glass under the chip. All of this is facilitated by the
PCF8576 bonding pad layout (see Fig.30). Pads needing
bus interconnection between all PCF8576s of the cascade
are VDD, VSS, VLCD, CLK, SCL, SDA and SYNC. These
lines may be led to the corresponding pads of the next
PCF8576 through the wide opening between VLCD pad
and the backplane output pads. The only bus line that does
not require a second opening to lead through to the next
PCF8576 is VLCD, being the cascade centre. The placing
of VLCD adjacent to VSS allows the two supplies to be
connected together.
When an external clocking source is to be used, OSC of all
devices should be connected to VDD. The pads OSC,
A0, A1, A2 and SA0 have been placed between
VSS and VDD to facilitate wiring of oscillator, hardware
subaddress and slave address.
13 BONDING PAD INFORMATION
Fig.30 Bonding pad locations.
Bonding pad dimensions: 120
× 120 m.
Gold bump dimensions: 94
× 94 × 25 m.
handbook, full pagewidth
MBK282
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S17
S16
S15
S14
S13
S12
S11
S10
S9
S8
S7
S6
S5
S4
S3
S2
S1
S0
BP3
BP1
BP2
BP0
VLCD
VSS
SA0
A2
A1
A0
OSC
V
DD
CLK
SCL
SDA
S39
S38
S37
S36
S35
S34
S33
S32
S31
S30
S29
S28
S27
S26
S25
S24
S23
S22
S21
S20
S19
S18
SYNC
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14
PCF8576
x
y
0
cascade
centre
3.07 mm
4.12
mm
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