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参数资料
| 型号： | 935262233118 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 16 I/O, PIA-GENERAL PURPOSE, PDSO24 |
| 封装： | 5.30 MM, PLASTIC, SSOP-24 |
| 文件页数： | 11/26页 |
| 文件大小： | 140K |
| 代理商： | 935262233118 |
1999 Apr 07
19
Philips Semiconductors
Product specication
Remote 16-bit I/O expander for I2C-bus
PCF8575
14.5
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW(1)
HLQFP, HSQFP, HSOP, SMS
not suitable(2)
suitable
PLCC(3), SO
suitable
LQFP, QFP, TQFP
not recommended(3)(4)
suitable
SQFP
not suitable
suitable
SSOP, TSSOP, VSO
not recommended(5)
suitable
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