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| 型号： | 935267286112 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | Buffer和线驱动 |
| 英文描述： | LINE TRANSCEIVER, PDSO16 |
| 封装： | 4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16 |
| 文件页数： | 15/25页 |
| 文件大小： | 594K |
| 代理商： | 935267286112 |
Philips Semiconductors
ISP1105/1106/1107
Advanced USB transceivers
Product data
Rev. 07 — 29 March 2002
22 of 25
9397 750 09529
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
16. Additional soldering information
16.1 (H)BCC packages: footprint
The surface material of the terminals on the resin protrusion consists of a 4-layer
metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1
m min.) ensures
solderability, the Ni layer (5
m min.) prevents diffusion, and the Pd layer on top
(0.5
m min.) ensures effective wire bonding.
16.2 (H)BCC packages: reow soldering prole
The conditions for reow soldering of (H)BCC packages are as follows:
Preheating time: minimum 90 s at T = 145 to 155
°C
Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183
°C
Peak temperature:
– Ambient temperature: Tamb(max) = 260 °C
– Device surface temperature: Tcase(max) = 255 °C.
Cavity: exposed diepad, either functioning as heatsink or as ground connection; only for HBCC packages.
Fig 16. (H)BCC footprint and solder resist mask dimensions.
004aaa123
b1
b
b2
Dh
0.05
All dimensions in mm
For exact dimensions
see package outline
drawing (SOT639-2)
Normal
Terminal
PCB land
Solder resist mask
Stencil mask
Solder land
Corner
0.05
b2
Eh
0.05
0.1
(4
×)
0.3 (8
×)
0.05
Solder resist
Solder stencil
b1
b
Stencil print thickness:
0.1 to 0.12 mm
Cavity
0.05
Dh
Eh
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PDF描述 |
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| 935269824112 | LINE TRANSCEIVER, PDSO16 |
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相关代理商/技术参数 |
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| 935267356112 | 制造商:NXP Semiconductors 功能描述:IC TEA1507PN |
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| 935269304128 | 制造商:ST-Ericsson 功能描述:IC AUDIO CODEC W/TCH SCRN 48LQFP |
| 935269544557 | 制造商:NXP Semiconductors 功能描述:SUB ONLY TDA9587-2US1-V1.3 |
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