- 您现在的位置：买卖IC网 > PDF目录24826 > 935267473115 (NXP SEMICONDUCTORS) AHC SERIES, 1-INPUT INVERT GATE, PDSO5 PDF资料下载
参数资料
| 型号： | 935267473115 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | 门电路 |
| 英文描述： | AHC SERIES, 1-INPUT INVERT GATE, PDSO5 |
| 封装： | PLASTIC, SOT-353, SC-88A, 5 PIN |
| 文件页数： | 4/16页 |
| 文件大小： | 81K |
| 代理商： | 935267473115 |
2002 Oct 02
12
Philips Semiconductors
Product specication
Inverter with open-drain output
74AHC1G06; 74AHCT1G06
Suitability of surface mount IC packages for wave and reow soldering methods
Notes
1. For more detailed information on the BGA packages refer to the
“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
“Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
PACKAGE(1)
SOLDERING METHOD
WAVE
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
not suitable
suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
not suitable(3)
suitable
PLCC(4), SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended(4)(5)
suitable
SSOP, TSSOP, VSO
not recommended(6)
suitable
相关PDF资料 |
PDF描述 |
|---|---|
| 935267473118 | AHC SERIES, 1-INPUT INVERT GATE, PDSO5 |
| 935267474115 | AHCT/VHCT SERIES, 1-INPUT INVERT GATE, PDSO5 |
| 935267474165 | AHCT/VHCT SERIES, 1-INPUT INVERT GATE, PDSO5 |
| 935271654125 | AHC SERIES, 1-INPUT INVERT GATE, PDSO5 |
| 935267474118 | AHCT/VHCT SERIES, 1-INPUT INVERT GATE, PDSO5 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 935268081112 | 制造商:NXP Semiconductors 功能描述:SUB ONLY IC |
| 935268721125 | 制造商:NXP Semiconductors 功能描述:Buffer/Line Driver 1-CH Non-Inverting 3-ST CMOS 5-Pin TSSOP T/R |
| 935269304128 | 制造商:ST-Ericsson 功能描述:IC AUDIO CODEC W/TCH SCRN 48LQFP |
| 935269544557 | 制造商:NXP Semiconductors 功能描述:SUB ONLY TDA9587-2US1-V1.3 |
| 935269987557 | 制造商:NXP Semiconductors 功能描述:SUB ONLY TDA9587-1US1-V1.8 SUBBED TO 935269987557 |
发布紧急采购，3分钟左右您将得到回复。