- 您现在的位置：买卖IC网 > PDF目录24830 > 935269117115 (NXP SEMICONDUCTORS) LINE TRANSCEIVER, PBCC16 PDF资料下载
参数资料
| 型号： | 935269117115 |
| 厂商： | NXP SEMICONDUCTORS |
| 元件分类： | Buffer和线驱动 |
| 英文描述： | LINE TRANSCEIVER, PBCC16 |
| 封装： | 3 X 3 X 0.65 MM, PLASTIC, MO-217, SOT-639-2, HBCC-16 |
| 文件页数： | 14/25页 |
| 文件大小： | 594K |
| 代理商： | 935269117115 |
Philips Semiconductors
ISP1105/1106/1107
Advanced USB transceivers
Product data
Rev. 07 — 29 March 2002
21 of 25
9397 750 09529
Koninklijke Philips Electronics N.V. 2002. All rights reserved.
During placement and before soldering, the package must be xed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time is 4 seconds at 250
°C. A mildly-activated ux will eliminate the
need for removal of corrosive residues in most applications.
15.4 Manual soldering
Fix the component by rst soldering two diagonally-opposite end leads. Use a low
voltage (24 V or less) soldering iron applied to the at part of the lead. Contact time
must be limited to 10 seconds at up to 300
°C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 to 5 seconds between 270 and 320
°C.
15.5 Package related soldering information
[1]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the
maximum temperature (with respect to time) and body size of the package, there is a risk that internal
or external package cracks may occur due to vaporization of the moisture in them (the so called
popcorn effect). For details, refer to the Drypack information in the
Data Handbook IC26; Integrated
Circuit Packages; Section: Packing Methods.
[2]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
[3]
If wave soldering is considered, then the package must be placed at a 45
° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[4]
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger
than 0.8 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[5]
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is denitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Table 18:
Suitability of surface mount IC packages for wave and reow soldering
methods
Package
Soldering method
Wave
Reow[1]
BGA, HBGA, LFBGA, SQFP, TFBGA
not suitable
suitable
HBCC, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, SMS
not suitable[2]
suitable
PLCC[3], SO, SOJ
suitable
LQFP, QFP, TQFP
not recommended[3][4]
suitable
SSOP, TSSOP, VSO
not recommended[5]
suitable
相关PDF资料 |
PDF描述 |
|---|---|
| 935267286118 | LINE TRANSCEIVER, PDSO16 |
| 935267286112 | LINE TRANSCEIVER, PDSO16 |
| 935269824112 | LINE TRANSCEIVER, PDSO16 |
| 935269824118 | LINE TRANSCEIVER, PDSO16 |
| 935269825115 | LINE TRANSCEIVER, PBCC16 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 935269304128 | 制造商:ST-Ericsson 功能描述:IC AUDIO CODEC W/TCH SCRN 48LQFP |
| 935269544557 | 制造商:NXP Semiconductors 功能描述:SUB ONLY TDA9587-2US1-V1.3 |
| 935269987557 | 制造商:NXP Semiconductors 功能描述:SUB ONLY TDA9587-1US1-V1.8 SUBBED TO 935269987557 |
| 935270713557 | 制造商:NXP Semiconductors 功能描述:SUB ONLY IC CHP |
| 935270792551 | 制造商:NXP Semiconductors 功能描述:IC BUFF DVR TRI-ST 16BIT 56VFBGA |
发布紧急采购，3分钟左右您将得到回复。