参数资料
型号: 93AA56BXT-I/MC
元件分类: PROM
英文描述: 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
封装: 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8
文件页数: 12/30页
文件大小: 551K
代理商: 93AA56BXT-I/MC
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
DS21794F-page 2
2008 Microchip Technology Inc.
Package Types (not to scale)
CS
CLK
DI
DO
1
2
3
4
8
7
6
5
VCC
NC
ORG*
VSS
PDIP/SOIC
(P, SN)
CS
CLK
DI
DO
1
2
3
4
8
7
6
5
VCC
NC
ORG*
VSS
ROTATED SOIC
(ex: 93LC46BX)
TSSOP/MSOP
CS
CLK
DI
DO
1
2
3
4
8
7
6
5
VCC
NC
ORG*
VSS
(ST, MS)
SOT-23
DO
VSS
DI
1
2
3
6
5
4
VCC
CS
CLK
(OT)
*ORG pin is NC on A/B devices.
DFN
CS
CLK
DI
DO
NC
ORG*
VSS
VCC
8
7
6
5
1
2
3
4
(MC)
相关PDF资料
PDF描述
93AA56CT-I/MC 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
93C56AX-I/MC 256 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8
93C56AXT-E/MS 256 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8
93LC56BX-I/P 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8
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相关代理商/技术参数
参数描述
93AA56C 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:2K Microwire Compatible Serial EEPROM
93AA56C/S15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 1.8V DIE IN WAFFLE PK, IND - Gel-pak, waffle pack, wafer, diced wafer on film
93AA56C/W15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 1.8V WAFER, IND - Gel-pak, waffle pack, wafer, diced wafer on film
93AA56C/WF15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 1.8V WAFER ON FR, IND - Gel-pak, waffle pack, wafer, diced wafer on film
93AA56C-E/CH 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs