参数资料
型号: 93C56BXT-I/SNG
元件分类: PROM
英文描述: 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
封装: 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
文件页数: 5/30页
文件大小: 551K
代理商: 93C56BXT-I/SNG
2008 Microchip Technology Inc.
DS21794F-page 13
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
Example:
6-Lead SOT-23
8-Lead MSOP (150 mil)
Example:
XXXXXXT
YWWNNN
3L56BI
5281L7
XXNN
2EL7
T/XXXNNN
XXXXXXXX
YYWW
8-Lead PDIP
8-Lead SOIC
XXXXYYWW
XXXXXXXT
NNN
XXXX
TYWW
8-Lead TSSOP
NNN
I/P
1L7
93LC56B
0528
Example:
SN
0528
93LC56BI
1L7
L56B
I528
Example:
8-Lead 2x3 DFN
Example:
344
528
L7
XXX
YWW
NN
3
e
3
e
相关PDF资料
PDF描述
93LC56A-I/PG 256 X 8 MICROWIRE BUS SERIAL EEPROM, PDIP8
93LC56A-I/SNG 256 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8
93LC56BT-E/STG 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
93LC56BXT-E/SNG 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
93AA56CX-I/ST 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
相关代理商/技术参数
参数描述
93C56C 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:2K Microwire Compatible Serial EEPROM
93C56C/S15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93C56C/W15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93C56C/WF15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93C56C-E/CH 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs