参数资料
| 型号： | 93C76-E/SN |
| 厂商： | Microchip Technology |
| 文件页数： | 12/20页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 8KBIT 2MHZ 8SOIC |
| 标准包装： | 100 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 8K（1K x 8 或 512 x 16） |
| 速度： | 2MHz |
| 接口： | Microwire 3 线串行 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 125°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOICN |
| 包装： | 管件 |
93C76/86
8-Lead Plastic Dual In-line (P) – 300 mil Body (PDIP)
E1
D
2
n
E
1
α
A
A2
β
eB
c
Units
A1
INCHES*
B1
B
p
MILLIMETERS
L
Dimension Limits
MIN
NOM
MAX
MIN
NOM
MAX
Number of Pins
Pitch
n
p
8
.100
8
2.54
Top to Seating Plane
Molded Package Thickness
A
A2
.140
.115
.155
.130
.170
.145
3.56 3.94
2.92 3.30
4.32
3.68
Base to Seating Plane
A1
.015
0.38
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
E
E1
D
L
c
B1
B
.300
.240
.360
.125
.008
.045
.014
.313
.250
.373
.130
.012
.058
.018
.325
.260
.385
.135
.015
.070
.022
7.62 7.94
6.10 6.35
9.14 9.46
3.18 3.30
0.20 0.29
1.14 1.46
0.36 0.46
8.26
6.60
9.78
3.43
0.38
1.78
0.56
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
§
eB
α
β
.310
5
5
.370
10
10
.430
15
15
7.87 9.40
5 10
5 10
10.92
15
15
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21132E-page 12
? 2004 Microchip Technology Inc.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 93C76-I/P | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8K/16K 5.0V Microwire Serial EEPROM |
| 93C76-I/SN | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Microwire Serial EEPROM |
| 93C76-IP | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8K/16K 5.0V Microwire Serial EEPROM |
| 93C76-ISN | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8K/16K 5.0V Microwire Serial EEPROM |
| 93C76-P | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8K/16K 5.0V Microwire Serial EEPROM |
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