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参数资料
| 型号： | 93C76BT-I/P |
| 元件分类： | PROM |
| 英文描述： | 128 X 8 MICROWIRE BUS SERIAL EEPROM, PDIP8 |
| 封装： | 0.300 INCH, LEAD FREE, PLASTIC, MS-001, DIP-8 |
| 文件页数： | 19/38页 |
| 文件大小： | 700K |
| 代理商： | 93C76BT-I/P |
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93XX46X/56X/66X/76X/86X
DS21929D-page 26
2007 Microchip Technology Inc.
8-Lead Plastic Dual In-Line (P or PA) – 300 mil Body [PDIP]
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
INCHES
Dimension Limits
MIN
NOM
MAX
Number of Pins
N
8
Pitch
e
.100 BSC
Top to Seating Plane
A
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.060
.070
Lower Lead Width
b
.014
.018
.022
Overall Row Spacing §
eB
–
.430
N
E1
NOTE 1
D
12
3
A
A1
A2
L
b1
b
e
E
eB
c
Microchip Technology Drawing C04-018B
相关PDF资料 |
PDF描述 |
|---|---|
| 93C76C-E/OT | 512 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO6 |
| 93LC56BT-I/PG | 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8 |
| 93LC76A-E/MC | 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8 |
| 93LC56C-I/OT | 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO6 |
| 93AA86BT-E/P | 128 X 8 MICROWIRE BUS SERIAL EEPROM, PDIP8 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| 93C76C | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:8K Microwire Compatible Serial EEPROM |
| 93C76C/S15K | 制造商:Microchip Technology Inc 功能描述:8K, 512 X 16 OR 1024 X 8 SERIA - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93C76C/W15K | 制造商:Microchip Technology Inc 功能描述:8K, 512 X 16 OR 1024 X 8 SERIA - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93C76C/WF15K | 制造商:Microchip Technology Inc 功能描述:8K, 512 X 16 OR 1024 X 8 SERIA - Gel-pak, waffle pack, wafer, diced wafer on film |
| 93C76C-E/CH | 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs |
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