参数资料
型号: 93LC56BXT-I/SNG
元件分类: PROM
英文描述: 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
封装: 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8
文件页数: 16/30页
文件大小: 551K
代理商: 93LC56BXT-I/SNG
2008 Microchip Technology Inc.
DS21794F-page 23
93AA56A/B/C, 93LC56A/B/C, 93C56A/B/C
APPENDIX A:
REVISION HISTORY
Revision B
Corrections to Section 1.0, Electrical Characteristics.
Section 4.1, 6-Lead SOT-23 package to OT.
Revision C
Added DFN package.
Revision D (11/2006)
Updated Package Drawings and Product ID System
Revision E (3/2007)
Replaced Package Drawings; Revised Product ID
System (SOIC-SN package).
Revision F (5/2008)
Revised Figures 2-1 through 2-4 and Figures 2-8
through 2-11; Revised Package Marking Information;
Replaced Package Drawings; Revised Product ID
section.
相关PDF资料
PDF描述
93LC56AT-E/OT 256 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO6
93LC56CT-E/ST 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
93AA56B-I/MC 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
93AA56BXT-I/OT 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO6
93AA56CX-I/SN 128 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
相关代理商/技术参数
参数描述
93LC56C 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:2K Microwire Compatible Serial EEPROM
93LC56C/S15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93LC56C/W15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93LC56C/WF15K 制造商:Microchip Technology Inc 功能描述:2K, 256 X 8 OR 128 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93LC56C-E/CH 制造商:MICROCHIP 制造商全称:Microchip Technology 功能描述:1K-16K Microwire Compatible Serial EEPROMs