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参数资料
型号： 93LC66BXT-E/MC
元件分类： PROM
英文描述： 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
封装： 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8
文件页数： 25/30页
文件大小： 550K
代理商： 93LC66BXT-E/MC
93AA66A/B/C, 93LC66A/B/C, 93C66A/B/C
DS21795D-page 4
2008 Microchip Technology Inc.
TABLE 1-2:
AC CHARACTERISTICS
All parameters apply over the specified
ranges unless otherwise noted.
Industrial (I):
TA = -40°C to +85°C, VCC = +1.8V to +5.5V
Automotive (E):
TA = -40°C to +125°C, VCC = +2.5V to +5.5V
Param.
No.
Symbol
Parameter
Min
Max
Units
Conditions
A1
FCLK
Clock frequency
—
3
2
1
MHz
4.5V
≤ VCC < 5.5V, 93XX66C only
2.5V
≤ VCC < 5.5V
1.8V
≤ VCC < 2.5V
A2
TCKH
Clock high time
200
250
450
—ns
ns
4.5V
≤ VCC < 5.5V, 93XX66C only
2.5V
≤ VCC < 5.5V
1.8V
≤ VCC < 2.5V
A3
TCKL
Clock low time
100
200
450
—ns
ns
4.5V
≤ VCC < 5.5V, 93XX66C only
2.5V
≤ VCC < 5.5V
1.8V
≤ VCC < 2.5V
A4
TCSS
Chip Select setup time
50
100
250
—ns
ns
4.5V
≤ VCC < 5.5V
2.5V
≤ VCC < 4.5V
1.8V
≤ VCC < 2.5V
A5
TCSH
Chip Select hold time
0
—
ns
1.8V
≤ VCC < 5.5V
A6
TCSL
Chip Select low time
250
—
ns
1.8V
≤ VCC < 5.5V
A7
TDIS
Data input setup time
50
100
250
—ns
ns
4.5V
≤ VCC < 5.5V, 93XX66C only
2.5V
≤ VCC < 5.5V
1.8V
≤ VCC < 2.5V
A8
TDIH
Data input hold time
50
100
250
—ns
ns
4.5V
≤ VCC < 5.5V, 93XX66C only
2.5V
≤ VCC < 5.5V
1.8V
≤ VCC < 2.5V
A9
TPD
Data output delay time
—
200
250
400
ns
4.5V
≤ VCC < 5.5V, CL = 100 pF
2.5V
≤ VCC < 4.5V, CL = 100 pF
1.8V
≤ VCC < 2.5V, CL = 100 pF
A10
TCZ
Data output disable time
—
100
200
ns
4.5V
≤ VCC < 5.5V, (Note 1)
1.8V
≤ VCC < 4.5V, (Note 1)
A11
TSV
Status valid time
—
200
300
500
ns
4.5V
≤ VCC < 5.5V, CL = 100 pF
2.5V
≤ VCC < 4.5V, CL = 100 pF
1.8V
≤ VCC < 2.5V, CL = 100 pF
A12
TWC
Program cycle time
—
6
ms
Erase/Write mode (AA and LC
versions)
A13
TWC
—
2
ms
Erase/Write mode
(93C versions)
A14
TEC
—
6
ms
ERAL mode, 4.5V
≤ VCC ≤ 5.5V
A15
TWL
—
15
ms
WRAL mode, 4.5V
≤ VCC ≤ 5.5V
A16
—
Endurance
1M
—
cycles 25°C, VCC = 5.0V, (Note 2)
Note 1:
This parameter is periodically sampled and not 100% tested.
2:
This application is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance Model, which may be obtained from Microchip’s web
site at www.microchip.com.
相关PDF资料
PDF描述
93LC66BXT-I/ST 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
93LC66CX-E/P 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDIP8
93LC66A-I/ST 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8
93LC66AXT-I/SN 512 X 8 MICROWIRE BUS SERIAL EEPROM, PDSO8
93AA66C-I/MSG 256 X 16 MICROWIRE BUS SERIAL EEPROM, PDSO8
相关代理商/技术参数
参数描述
93LC66BXT-I/SN 功能描述:电可擦除可编程只读存储器 256x16 Rot Pin RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8
93LC66BXT-I/SNG 功能描述:电可擦除可编程只读存储器 256x16 Rot Pin Lead Free Package RoHS:否 制造商:Atmel 存储容量:2 Kbit 组织:256 B x 8 数据保留:100 yr 最大时钟频率:1000 KHz 最大工作电流:6 uA 工作电源电压:1.7 V to 5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:SOIC-8
93LC66C/S15K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8 OR 256 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93LC66C/W15K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8 OR 256 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
93LC66C/WF15K 制造商:Microchip Technology Inc 功能描述:4K, 512 X 8 OR 256 X 16 SERIAL - Gel-pak, waffle pack, wafer, diced wafer on film
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