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参数资料
| 型号： | A1150LLHLX-T |
| 厂商： | Allegro Microsystems Inc |
| 文件页数： | 9/12页 |
| 文件大小： | 260K |
| 描述： | IC HALL EFFECT SW UNI SOT-23W |
| 标准包装： | 30,000 |
| 传感范围： | 110G 跳闸，45G 释放 |
| 类型： | 单极开关 |
| 电源电压： | 3 V ~ 24 V |
| 电流 - 电源： | 5mA |
| 输出类型： | 数字 |
| 特点： | 高速度 |
| 工作温度： | -40°C ~ 150°C |
| 封装/外壳： | SOT-23W |
| 供应商设备封装： | SOT-23W |
| 包装： | 带卷 (TR) |
Chopper-Stabilized, Two Wire
Hall-Effect Switches
A1150, A1152, A1153, A1155,
A1156, A1157, and A1158
9
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
The device must be operated below the maximum junction tem-
perature of the device, T
J
(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating T
J
. (Thermal data is also available on the
Allegro MicroSystems Web site.)
The Package Thermal Resistance, R
qJA
, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, R
qJC
, is relatively
small component of R
qJA
. Ambient air temperature, T
A
, and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, P
D
), can
be estimated. The following formulas represent the fundamental
relationships used to estimate T
J
, at P
D
.
P
D
= V
IN
?/DIV>
I
IN
(1)
DT = P
D
?/DIV>
R
qJA
(2)
T
J
= T
A
+ 擳
(3)
For example, given common conditions such as: T
A
= 25癈,
V
CC
= 12 V, I
CC
= 4 mA, and R
qJA
= 140 癈/W, then:
P
D
= V
CC
?/DIV>
I
CC
= 12 V
?/DIV>
4 mA = 48 mW
DT = P
D
?/DIV>
R
qJA
= 48 mW
?/DIV>
140 癈/W = 7癈
T
J
= T
A
+ DT = 25癈 + 7癈 = 32癈
A worst-case estimate, P
D
(max), represents the maximum allow-
able power level (V
CC
(max), I
CC
(max)), without exceeding
T
J
(max), at a selected R
qJA
and T
A
.
Example: Reliability for V
CC
at T
A
=
150癈, package UA, using a
low-K PCB.
Observe the worst-case ratings for the device, specifically:
R
qJA
=
165 癈/W, T
J
(max)
=
165癈, V
CC
(max)
=
24 V, and
I
CC
(max)
=
17
mA.
Calculate the maximum allowable power level, P
D
(max). First,
invert equation 3:
DT
max
= T
J
(max) T
A
= 165
癈
150
癈 = 15
癈
This provides the allowable increase to T
J
resulting from internal
power dissipation. Then, invert equation 2:
P
D
(max)
= DT
max
?R
qJA
= 15癈 ?165 癈/W = 91 mW
Finally, invert equation 1 with respect to voltage:
V
CC(est)
= P
D
(max)
? I
CC
(max) = 91 mW ?17 mA = 5 V
The result indicates that, at T
A
, the application and device can
dissipate adequate amounts of heat at voltages dV
CC(est)
.
Compare V
CC(est)
to V
CC
(max). If V
CC(est)
d V
CC
(max), then reli-
able operation between V
CC(est)
and V
CC
(max) requires enhanced
R
qJA
. If V
CC(est)
e V
CC
(max), then operation between V
CC(est)
and V
CC
(max) is reliable under these conditions.
Power Derating
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