参数资料
型号: A1223ELHLX-T
厂商: Allegro Microsystems Inc
文件页数: 12/16页
文件大小: 347K
描述: SENSOR HALL EFF DGTL LATCH SOT23
标准包装: 30,000
传感范围: 180G 跳闸,-180G 释放
类型: 双极卡锁
电源电压: 3 V ~ 24 V
电流 - 电源: 4mA
电流 - 输出(最大): 25mA
输出类型: 数字式,开漏极
特点: 稳压电压
工作温度: -40°C ~ 85°C
封装/外壳: SOT-23W
供应商设备封装: SOT-23W
包装: 带卷 (TR)
Chopper Stabilized Precision Hall Effect Latches
A1220, A1221,
A1222, and A1223
12
Allegro MicroSystems, LLC
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Power Derating
The device must be operated below the maximum junction
temperature of the device, T
J(max)
. Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating T
J
. (Thermal data is also available on the
Allegro MicroSystems website.)
The Package Thermal Resistance, R
qJA
, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, R
qJC
, is relatively
small component of R
qJA
. Ambient air temperature, T
A
, and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, P
D
), can
be estimated. The following formulas represent the fundamental
relationships used to estimate T
J
, at P
D
.
  P
D
= V
IN
 
?/DIV>
 I
IN
(1)
    DT = P
D
 
?/DIV>
 R
qJA
      (2)
    T
J
 = T
A
 + 擳     (3)
For example, given common conditions such as: T
A
= 25癈,
V
CC
= 12 V, I
CC
= 1.6 mA, and R
qJA
 = 165 癈/W, then:
    P
D
= V
CC
 
?/DIV>
 I
CC
= 12 V
?/DIV>
 1.6 mA = 19 mW
   DT = P
D
 
?/DIV>
 R
qJA
 = 19 mW
?/DIV>
 165 癈/W = 3癈
    T
J
 = T
A
 + DT = 25癈 + 3癈 = 28癈
A worst-case estimate, P
D(max)
, represents the maximum allow-
able power level (V
CC(max)
, I
CC(max)
), without exceeding T
J(max)
,
at a selected R
qJA
 and T
A
.
Example: Reliability for V
CC
 at T
A
=
 
150癈, package LH, using a
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
R
qJA
=
 
228癈/W, T
J
(max)
 
=
 
165癈, V
CC
(max)
 
=
 
24 V, and
I
CC
(max)
 
=
 
4
 
mA.
Calculate the maximum allowable power level, P
D
(max). First,
invert equation 3:
  DT
max
 = T
J
(max)  T
A
 = 165
 
 

 
150
 
癈 = 15
 
This provides the allowable increase to T
J
 resulting from internal
power dissipation. Then, invert equation 2:
  P
D
(max)
 
= DT
max
 ?R
qJA
= 15癈 ?228 癈/W = 66 mW
Finally, invert equation 1 with respect to voltage:
  V
CC(est)
 = P
D
(max)
 
? I
CC
(max) = 66 mW ?4 mA = 16.4 V
The result indicates that, at T
A
, the application and device can
dissipate adequate amounts of heat at voltages dV
CC(est)
.
Compare V
CC(est)
 to V
CC
(max). If V
CC(est)
 d V
CC
(max), then reli-
able operation between V
CC(est)
 and V
CC
(max) requires enhanced
R
qJA
. If V
CC(est)
 e V
CC
(max), then operation between V
CC(est)
 
and V
CC
(max) is reliable under these conditions.
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