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| 型号： | A1223LUA-T |
| 元件分类： | 磁阻传感器 |
| 英文描述： | MAGNETIC FIELD SENSOR-HALL EFFECT, -18-18mT, 30-60mA, RECTANGULAR, THROUGH HOLE MOUNT |
| 封装： | LEAD FREE, ULTRA MINI, SIP-3 |
| 文件页数： | 4/14页 |
| 文件大小： | 290K |
| 代理商： | A1223LUA-T |
Chopper Stabilized Precision Hall Effect Latches
A1220, A1221,
A1222, and A1223
12
Allegro MicroSystems, Inc.
115 Northeast Cutoff
Worcester, Massachusetts 01615-0036 U.S.A.
1.508.853.5000; www.allegromicro.com
Power Derating
The device must be operated below the maximum junction
temperature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems website.)
The Package Thermal Resistance, RJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RJC, is relatively
small component of RJA. Ambient air temperature, TA, and air
motion are significant external factors, damped by overmolding.
The effect of varying power levels (Power Dissipation, PD), can
be estimated. The following formulas represent the fundamental
relationships used to estimate TJ, at PD.
PD = VIN
× IIN
(1)
T = PD
× RJA
(2)
TJ = TA + ΔT
(3)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 1.6 mA, and RJA = 165 °C/W, then:
PD = VCC
× ICC = 12 V × 1.6 mA = 19 mW
T = PD
× RJA = 19 mW × 165 °C/W = 3°C
TJ = TA + T = 25°C + 3°C = 28°C
A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding TJ(max),
at a selected RJA and TA.
Example: Reliability for VCC at TA=150°C, package LH, using a
minimum-K PCB.
Observe the worst-case ratings for the device, specifically:
RJA=228°C/W, TJ(max) =165°C, VCC(max) = 24 V, and
ICC(max) = 4 mA.
Calculate the maximum allowable power level, PD(max). First,
invert equation 3:
Tmax = TJ(max) – TA = 165°C–150°C = 15°C
This provides the allowable increase to TJ resulting from internal
power dissipation. Then, invert equation 2:
PD(max) = Tmax÷RJA =15°C÷228 °C/W=66mW
Finally, invert equation 1 with respect to voltage:
VCC(est) = PD(max) ÷ ICC(max)= 66mW÷4mA=16.4 V
The result indicates that, at TA, the application and device can
dissipate adequate amounts of heat at voltages ≤VCC(est).
Compare VCC(est) to VCC(max). If VCC(est) ≤ VCC(max), then reli-
able operation between VCC(est) and VCC(max) requires enhanced
RJA. If VCC(est) ≥ VCC(max), then operation between VCC(est)
and VCC(max) is reliable under these conditions.
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