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| 型号： | A1425A-1PQG160I |
| 元件分类： | FPGA |
| 英文描述： | FPGA, 310 CLBS, 2500 GATES, PQFP160 |
| 封装： | PLASTIC, QFP-160 |
| 文件页数： | 9/68页 |
| 文件大小： | 489K |
| 代理商： | A1425A-1PQG160I |
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1-191
Accelerator Series FPGAs – ACT 3 Family
Active Power Component
Power dissipation in CMOS devices is usually dominated by
the active (dynamic) power dissipation. This component is
frequency dependent, a function of the logic and the external
I/O. Active power dissipation results from charging internal
chip capacitances of the interconnect, unprogrammed
antifuses, module inputs, and module outputs, plus external
capacitance due to PC board traces and load device inputs.
An additional component of the active power dissipation is
the totem-pole current in CMOS transistor pairs. The net
effect can be associated with an equivalent capacitance that
can be combined with frequency and voltage to represent
active power dissipation.
Equivalent Capacitance
The power dissipated by a CMOS circuit can be expressed by
the Equation 2.
Power (uW) = CEQ * VCC
2 * F
(2)
Where:
CEQ is the equivalent capacitance expressed in pF.
VCC is the power supply in volts.
F is the switching frequency in MHz.
Equivalent capacitance is calculated by measuring ICCactive
at a specified frequency and voltage for each circuit
component of interest. Measurements have been made over a
range of frequencies at a fixed value of VCC. Equivalent
capacitance is frequency independent so that the results may
be used over a wide range of operating conditions. Equivalent
capacitance values are shown below.
CEQ Values for Actel FPGAs
To calculate the active power dissipated from the complete
design, the switching frequency of each part of the logic must
be known. Equation 3 shows a piece-wise linear summation
over all components.
Power =VCC2 * [(m * CEQM* fm)modules + (n * CEQI* fn)inputs
+ (p * (CEQO+ CL) * fp)outputs
+ 0.5 * (q1 * CEQCR * fq1)routed_Clk1 + (r1 * fq1)routed_Clk1
+ 0.5 * (q2 * CEQCR * fq2)routed_Clk2
+ (r2 * fq2)routed_Clk2 + 0.5 * (s1 * CEQCD * fs1)dedicated_Clk
+ (s2 * CEQCI * fs2)IO_Clk]
(3)
Where:
Modules (CEQM)
6.7
Input Buffers (CEQI)
7.2
Output Buffers (CEQO)
10.4
Routed Array Clock Buffer Loads (CEQCR)
1.6
Dedicated Clock Buffer Loads (CEQCD)
0.7
I/O Clock Buffer Loads (CEQCI)
0.9
m
= Number of logic modules switching at fm
n
= Number of input buffers switching at fn
p
= Number of output buffers switching at fp
q1
= Number of clock loads on the first routed
array clock
q2
= Number of clock loads on the second routed
array clock
r1
= Fixed capacitance due to first routed array
clock
r2
= Fixed capacitance due to second routed array
clock
s1
= Fixed number of clock loads on the dedicated
array clock
s2
= Fixed number of clock loads on the dedicated
I/O clock
CEQM
= Equivalent capacitance of logic modules in pF
CEQI
= Equivalent capacitance of input buffers in pF
CEQO
= Equivalent capacitance of output buffers in
pF
CEQCR = Equivalent capacitance of routed array clock
in pF
CEQCD = Equivalent capacitance of dedicated array
clock in pF
CEQCI
= Equivalent capacitance of dedicated I/O clock
in pF
CL
= Output lead capacitance in pF
fm
= Average logic module switching rate in MHz
fn
= Average input buffer switching rate in MHz
fp
= Average output buffer switching rate in MHz
fq1
= Average first routed array clock rate in MHz
fq2
= Average second routed array clock rate in
MHz
fs1
= Average dedicated array clock rate in MHz
fs2
= Average dedicated I/O clock rate in MHz
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| A1425A-1VQ100C | 功能描述:IC FPGA 2500 GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ACT™ 3 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55） |
| A1425A-1VQ100I | 功能描述:IC FPGA 2500 GATES 100-VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ACT™ 3 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55） |
| A1425A-1VQG100C | 功能描述:IC FPGA 2500 GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ACT™ 3 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55） |
| A1425A-1VQG100I | 功能描述:IC FPGA 2500 GATES 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:ACT™ 3 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55） |
| A1425A-2PL84C | 制造商:Microsemi Corporation 功能描述:FPGA ACT 3 2.5K GATES 310 CELLS 200MHZ 0.8UM 5V 84PLCC - Rail/Tube 制造商:Microsemi SOC Products Group 功能描述:FPGA ACT 3 2.5K GATES 310 CELLS 200MHZ 0.8UM 5V 84PLCC - Rail/Tube |
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